EEWORLDEEWORLDEEWORLD

Part Number

Search

P8316A

Description
MASK ROM, 2KX8, 850ns, NMOS, PDIP24, PLASTIC, DIP-24
Categorystorage    storage   
File Size119KB,3 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

P8316A Overview

MASK ROM, 2KX8, 850ns, NMOS, PDIP24, PLASTIC, DIP-24

P8316A Parametric

Parameter NameAttribute value
MakerAMD
Objectid1418337707
Parts packaging codeDIP
package instructionDIP,
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
compound_id9577752
Maximum access time850 ns
JESD-30 codeR-PDIP-T24
length31.877 mm
memory density16384 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.461 mm
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyNMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

P8316A Related Products

P8316A C8316A AM9217BCC AM9217BDM AM9217ADM AM9217APC AM9217ADC AM9217ACC AM9217BPC AM9217BDC
Description MASK ROM, 2KX8, 850ns, NMOS, PDIP24, PLASTIC, DIP-24 MASK ROM, 2KX8, 850ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, PDIP24, PLASTIC, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 450ns, NMOS, PDIP24, PLASTIC, DIP-24 MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24
Maker AMD AMD AMD AMD AMD AMD AMD AMD AMD AMD
Parts packaging code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
package instruction DIP, DIP, DIP, DIP, DIP, DIP, DIP, DIP, DIP, DIP,
Contacts 24 24 24 24 24 24 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 850 ns 850 ns 450 ns 450 ns 550 ns 550 ns 550 ns 550 ns 450 ns 450 ns
JESD-30 code R-PDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-PDIP-T24 R-CDIP-T24 R-CDIP-T24 R-PDIP-T24 R-CDIP-T24
length 31.877 mm 30.099 mm 30.099 mm 30.099 mm 30.099 mm 31.877 mm 30.099 mm 30.099 mm 31.877 mm 30.099 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bi
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 125 °C 125 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.461 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm 5.461 mm 5.08 mm 5.08 mm 5.461 mm 5.08 mm
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
【Project source code】Two-person buzzer based on FPGA
Function: Two contestants participate in the competition, each has 10 seconds. If no one answers within 10 seconds, a warning sound will be issued, which will last for three seconds. After one of them...
小梅哥 Altera SoC
Comparison of the internal structures of TI's three major series of DSPs
1. IntroductionThere are two interpretations of DSP: one is Digital Signal Processor, also known as digital signal chip; the other is Digital Signal Processing. The DSP we are talking about refers to ...
灞波儿奔 Microcontroller MCU
CC2530 wireless lighting experiment
1. Download projectcc2530 experimental project download link 2. Burn the wireless transmission codeOpen the wireless light – wireless TX – CC2530 BasicRF – CC2530 BasicRF – ide – srf05_cc2530 – light_...
Jacktang Wireless Connectivity
How much did you lose in Big A today?
I'll come first. Today's opening was all in the red and closed at 2.8k. I was crying because of the loss.I asked my colleagues and they were even worse. They bought in today at 5% and have no money to...
吾妻思萌 Talking
What JLINK do you use?
[i=s]This post was last edited by Xin Xin on 2020-2-20 15:04[/i]Uh-huh, this is EETALK without the authorization of my cousin. We are talking about the most familiar JLINK Tell me about it What JLINK ...
辛昕 Talking
[National Technology N32G457 Review] SPI Transceiver Review
After several days of back and forth, the SPI communication test finally passed: 1. Test idea: spi1 is used for sending, spi2 is used for receiving. Send 32-bit data, and determine whether it is corre...
lugl4313820 Domestic Chip Exchange

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号