AM9217ACC datasheet, PDF - EEWORLD Datasheet

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AM9217ACC: DescriptionMASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24; Categorystorage storage; File Size119KB，3 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM9217ACC Overview

MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24

AM9217ACC Parametric

Parameter Name	Attribute value
Maker	AMD
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	550 ns
JESD-30 code	R-CDIP-T24
length	30.099 mm
memory density	16384 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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AM9217ACC Related Products

	AM9217ACC	C8316A	AM9217BCC	AM9217BDM	AM9217ADM	AM9217APC	AM9217ADC	AM9217BPC	P8316A	AM9217BDC
Description	MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24	MASK ROM, 2KX8, 850ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24	MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24	MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24	MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24	MASK ROM, 2KX8, 550ns, NMOS, PDIP24, PLASTIC, DIP-24	MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24	MASK ROM, 2KX8, 450ns, NMOS, PDIP24, PLASTIC, DIP-24	MASK ROM, 2KX8, 850ns, NMOS, PDIP24, PLASTIC, DIP-24	MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24
Maker	AMD	AMD	AMD	AMD	AMD	AMD	AMD	AMD	AMD	AMD
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
Contacts	24	24	24	24	24	24	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	550 ns	850 ns	450 ns	450 ns	550 ns	550 ns	550 ns	450 ns	850 ns	450 ns
JESD-30 code	R-CDIP-T24	R-CDIP-T24	R-CDIP-T24	R-CDIP-T24	R-CDIP-T24	R-PDIP-T24	R-CDIP-T24	R-PDIP-T24	R-PDIP-T24	R-CDIP-T24
length	30.099 mm	30.099 mm	30.099 mm	30.099 mm	30.099 mm	31.877 mm	30.099 mm	31.877 mm	31.877 mm	30.099 mm
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bi
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.461 mm	5.08 mm	5.461 mm	5.461 mm	5.08 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm

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