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AM9217BDM

Description
MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24
Categorystorage    storage   
File Size119KB,3 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM9217BDM Overview

MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24

AM9217BDM Parametric

Parameter NameAttribute value
MakerAMD
Parts packaging codeDIP
package instructionDIP,
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time450 ns
JESD-30 codeR-CDIP-T24
length30.099 mm
memory density16384 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyNMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

AM9217BDM Related Products

AM9217BDM C8316A AM9217BCC AM9217ADM AM9217APC AM9217ADC AM9217ACC AM9217BPC P8316A AM9217BDC
Description MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 850ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, PDIP24, PLASTIC, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 MASK ROM, 2KX8, 450ns, NMOS, PDIP24, PLASTIC, DIP-24 MASK ROM, 2KX8, 850ns, NMOS, PDIP24, PLASTIC, DIP-24 MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24
Maker AMD AMD AMD AMD AMD AMD AMD AMD AMD AMD
Parts packaging code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
package instruction DIP, DIP, DIP, DIP, DIP, DIP, DIP, DIP, DIP, DIP,
Contacts 24 24 24 24 24 24 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 450 ns 850 ns 450 ns 550 ns 550 ns 550 ns 550 ns 450 ns 850 ns 450 ns
JESD-30 code R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-PDIP-T24 R-CDIP-T24 R-CDIP-T24 R-PDIP-T24 R-PDIP-T24 R-CDIP-T24
length 30.099 mm 30.099 mm 30.099 mm 30.099 mm 31.877 mm 30.099 mm 30.099 mm 31.877 mm 31.877 mm 30.099 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bi
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 70 °C 70 °C 125 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.08 mm 5.08 mm 5.08 mm 5.461 mm 5.08 mm 5.08 mm 5.461 mm 5.461 mm 5.08 mm
Maximum supply voltage (Vsup) 5.5 V 5.25 V 5.25 V 5.5 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V 4.75 V 4.5 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS
Temperature level MILITARY COMMERCIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm

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