Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Micron Technology |
Parts packaging code | DIMM |
package instruction | DIMM, |
Contacts | 244 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | DUAL BANK PAGE BURST |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N244 |
JESD-609 code | e4 |
memory density | 19327352832 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 72 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 244 |
word count | 268435456 words |
character code | 256000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256MX72 |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Gold (Au) |
Terminal form | NO LEAD |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
MT18HTS25672PKY-53EXX | MT18HTS51272KY-53EXX | MT18HTS51272KY-667XX | MT18HTS51272PKY-53EXX | MT18HTS25672KY-667XX | MT18HTS25672KY-53EXX | |
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Description | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 512MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 512MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 512MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
package instruction | DIMM, | DIMM, | DIMM, | DIMM, | LEAD FREE, DIMM-244 | LEAD FREE, DIMM-244 |
Contacts | 244 | 244 | 244 | 244 | 244 | 244 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 |
JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 |
memory density | 19327352832 bit | 38654705664 bit | 38654705664 bit | 38654705664 bit | 19327352832 bit | 19327352832 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 72 | 72 | 72 | 72 | 72 | 72 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 244 | 244 | 244 | 244 | 244 | 244 |
word count | 268435456 words | 536870912 words | 536870912 words | 536870912 words | 268435456 words | 268435456 words |
character code | 256000000 | 512000000 | 512000000 | 512000000 | 256000000 | 256000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 256MX72 | 512MX72 | 512MX72 | 512MX72 | 256MX72 | 256MX72 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
self refresh | YES | YES | YES | YES | YES | YES |
Maximum supply voltage (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 |
Maker | Micron Technology | - | - | Micron Technology | Micron Technology | Micron Technology |