Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Micron Technology |
| Parts packaging code | DIMM |
| package instruction | LEAD FREE, DIMM-244 |
| Contacts | 244 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | DUAL BANK PAGE BURST |
| Other features | AUTO/SELF REFRESH |
| JESD-30 code | R-XDMA-N244 |
| JESD-609 code | e4 |
| memory density | 19327352832 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE |
| memory width | 72 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 244 |
| word count | 268435456 words |
| character code | 256000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256MX72 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIMM |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| self refresh | YES |
| Maximum supply voltage (Vsup) | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Gold (Au) |
| Terminal form | NO LEAD |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| MT18HTS25672KY-667XX | MT18HTS51272KY-53EXX | MT18HTS51272KY-667XX | MT18HTS51272PKY-53EXX | MT18HTS25672PKY-53EXX | MT18HTS25672KY-53EXX | |
|---|---|---|---|---|---|---|
| Description | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 512MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 512MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 512MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, DIMM-244 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| package instruction | LEAD FREE, DIMM-244 | DIMM, | DIMM, | DIMM, | DIMM, | LEAD FREE, DIMM-244 |
| Contacts | 244 | 244 | 244 | 244 | 244 | 244 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 code | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 | R-XDMA-N244 |
| JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 |
| memory density | 19327352832 bit | 38654705664 bit | 38654705664 bit | 38654705664 bit | 19327352832 bit | 19327352832 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| memory width | 72 | 72 | 72 | 72 | 72 | 72 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 244 | 244 | 244 | 244 | 244 | 244 |
| word count | 268435456 words | 536870912 words | 536870912 words | 536870912 words | 268435456 words | 268435456 words |
| character code | 256000000 | 512000000 | 512000000 | 512000000 | 256000000 | 256000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256MX72 | 512MX72 | 512MX72 | 512MX72 | 256MX72 | 256MX72 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| self refresh | YES | YES | YES | YES | YES | YES |
| Maximum supply voltage (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 |
| Maker | Micron Technology | - | - | Micron Technology | Micron Technology | Micron Technology |
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