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HY29LV800BF-55

Description
Flash, 512KX16, 55ns, PBGA48, 6 X 8 MM, FBGA-48
Categorystorage    storage   
File Size557KB,40 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HY29LV800BF-55 Overview

Flash, 512KX16, 55ns, PBGA48, 6 X 8 MM, FBGA-48

HY29LV800BF-55 Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeBGA
package instructionTFBGA, BGA48,6X8,32
Contacts48
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time55 ns
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-PBGA-B48
JESD-609 codee1
length8 mm
memory density8388608 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size1,2,1,15
Number of terminals48
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
power supply3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.1 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE
width6 mm
HY29LV800
8 Mbit (1M x 8/512K x 16) Low Voltage Flash Memory
KEY FEATURES
n
Single Power Supply Operation
– Read, program and erase operations from
2.7 to 3.6 volts
– Ideal for battery-powered applications
High Performance
– 70 and 90 ns access time versions for full
voltage range operation
– 55 ns access time version for operation
from 3.0 to 3.6 volts
Ultra-low Power Consumption (Typical
Values)
– Automatic sleep mode current: 0.2 µA
– Standby mode current: 0.2 µA
– Read current: 7 mA (at 5 Mhz)
– Program/erase current: 15 mA
Flexible Sector Architecture:
– One 16 KB, two 8 KB, one 32 KB and
fifteen 64 KB sectors in byte mode
– One 8 KW, two 4 KW, one 16 KW and
fifteen 32 KW sectors in word mode
– Top or bottom boot block configurations
available
Sector Protection
– Allows locking of a sector or sectors to
prevent program or erase operations
within that sector
– Sectors lockable in-system or via
programming equipment
– Temporary Sector Unprotect allows
changes in locked sectors (requires high
voltage on RESET# pin)
Fast Program and Erase Times
– Sector erase time: 0.5 sec typical for each
sector
– Chip erase time: 10 sec typical
– Byte program time: 9
µs
typical
– Word program time: 11
µs
typical
Unlock Bypass Program Command
– Reduces programming time when issuing
multiple program command sequences
Automatic Erase Algorithm Preprograms
and Erases Any Combination of Sectors
or the Entire Chip
Automatic Program Algorithm Writes and
Verifies Data at Specified Addresses
n
Minimum 100,000 Write Cycles per Sector
n
Compatible With JEDEC standards
– Pinout and software compatible with
single-power supply Flash devices
– Superior inadvertent write protection
Data# Polling and Toggle Bits
– Provide software confirmation of
completion of program and erase
operations
Ready/Busy# Pin
– Provides hardware confirmation of
completion of program and erase
operations
Erase Suspend/Erase Resume
– Suspends an erase operation to allow
reading data from, or programming data
to, a sector that is not being erased
– Erase Resume can then be invoked to
complete suspended erasure
Hardware Reset Pin (RESET#) Resets the
Device to Reading Array Data
Space Efficient Packaging
– 44-pin PSOP, 48-pin TSOP and 48-ball
FBGA packages
n
n
n
n
n
n
n
n
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LOGIC DIAGRAM
19
A[18:0]
DQ[7:0]
7
CE#
OE#
WE#
RESET#
BYTE#
RY/BY#
DQ[14:8]
DQ[15]/A[-1]
8
n
n
n
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Preliminary
Revision 1.0, November 2001

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