X76F041H-3 datasheet, PDF - EEWORLD Datasheet

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X76F041H-3: DescriptionFlash, 512X8, DIE; Categorystorage storage; File Size104KB，21 Pages; ManufacturerXicor Inc.

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X76F041H-3 Overview

Flash, 512X8, DIE

X76F041H-3 Parametric

Parameter Name	Attribute value
Maker	Xicor Inc.
package instruction	DIE
Reach Compliance Code	unknown
Other features	PASS SECURE FLASH
Maximum clock frequency (fCLK)	1 MHz
JESD-30 code	X-XUUC-N
memory density	4096 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Parallel/Serial	SERIAL
Programming voltage	3 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
type	NOR TYPE
Maximum write cycle time (tWC)	10 ms

X76F041H-3 Related Products

	X76F041H-3	X76F041A	X76F041HE-3	X76F041H	X76F041P-3	X76F041A-3	X76F041AE	X76F041W	X76F041W-3	X76F041PE
Description	Flash, 512X8, DIE	Flash, 512X8, PDSO8, 0.200 INCH, PLASTIC, EIAJ, SOIC-8	Flash, 512X8, DIE	Flash, 512X8, DIE	Flash, 512X8, PDIP8, PLASTIC, DIP-8	Flash, 512X8, PDSO8, 0.200 INCH, PLASTIC, EIAJ, SOIC-8	Flash, 512X8, PDSO8, 0.200 INCH, PLASTIC, EIAJ, SOIC-8	Flash, 512X8, WAFER	Flash, 512X8, WAFER	Flash, 512X8, PDIP8, PLASTIC, DIP-8
package instruction	DIE	0.200 INCH, PLASTIC, EIAJ, SOIC-8	DIE	DIE	PLASTIC, DIP-8	0.200 INCH, PLASTIC, EIAJ, SOIC-8	0.200 INCH, PLASTIC, EIAJ, SOIC-8	WAFER	WAFER	PLASTIC, DIP-8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow	unknow
Other features	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH	PASS SECURE FLASH
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz
JESD-30 code	X-XUUC-N	R-PDSO-G8	X-XUUC-N	X-XUUC-N	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	X-XUUC-N	X-XUUC-N	R-PDIP-T8
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi	4096 bi	4096 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	DIE	SOP	DIE	DIE	DIP	SOP	SOP	DIE	DIE	DIP
Package shape	UNSPECIFIED	RECTANGULAR	UNSPECIFIED	UNSPECIFIED	RECTANGULAR	RECTANGULAR	RECTANGULAR	UNSPECIFIED	UNSPECIFIED	RECTANGULAR
Package form	UNCASED CHIP	SMALL OUTLINE	UNCASED CHIP	UNCASED CHIP	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	UNCASED CHIP	UNCASED CHIP	IN-LINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Programming voltage	3 V	5 V	3 V	5 V	3 V	3 V	5 V	5 V	3 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.6 V	5.5 V	3.6 V	5.5 V	3.6 V	3.6 V	5.5 V	5.5 V	3.6 V	5.5 V
Minimum supply voltage (Vsup)	3 V	4.5 V	3 V	4.5 V	3 V	3 V	4.5 V	4.5 V	3 V	4.5 V
Nominal supply voltage (Vsup)	3.3 V	5 V	3.3 V	5 V	3.3 V	3.3 V	5 V	5 V	3.3 V	5 V
surface mount	YES	YES	YES	YES	NO	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	OTHER	COMMERCIAL	COMMERCIAL	COMMERCIAL	OTHER	COMMERCIAL	COMMERCIAL	OTHER
Terminal form	NO LEAD	GULL WING	NO LEAD	NO LEAD	THROUGH-HOLE	GULL WING	GULL WING	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal location	UPPER	DUAL	UPPER	UPPER	DUAL	DUAL	DUAL	UPPER	UPPER	DUAL
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
Maker	Xicor Inc.	-	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.

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