EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
Parts packaging code | DIP |
package instruction | PLASTIC, DIP-8 |
Contacts | 8 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 1 MHz |
Data retention time - minimum | 40 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
length | 9.817 mm |
memory density | 4096 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 512 words |
character code | 512 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512X8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 2.7/4.5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Serial bus type | SPI |
Maximum standby current | 0.000001 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 4.5 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Maximum write cycle time (tWC) | 15 ms |
write protect | HARDWARE/SOFTWARE |
FM25C040ULZN | FM25C040ULM8X | FM25C040ULZEM8X | FM25C040ULZEN | FM25C040ULMT8X | FM25C040ULEM8X | FM25C040ULEM8 | |
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Description | EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8 |
Parts packaging code | DIP | SOIC | SOIC | DIP | SOIC | SOIC | SOIC |
package instruction | PLASTIC, DIP-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum clock frequency (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
Data retention time - minimum | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
length | 9.817 mm | 4.9 mm | 4.9 mm | 9.817 mm | 4.4 mm | 4.9 mm | 4.9 mm |
memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
character code | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C |
Minimum operating temperature | - | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
organize | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | DIP | TSSOP | SOP | SOP |
Encapsulate equivalent code | DIP8,.3 | SOP8,.25 | SOP8,.25 | DIP8,.3 | TSSOP8,.25 | SOP8,.25 | SOP8,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
power supply | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm | 1.2 mm | 1.75 mm | 1.75 mm |
Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
Maximum standby current | 0.000001 A | 0.00001 A | 0.000001 A | 0.000001 A | 0.00001 A | 0.00001 A | 0.00001 A |
Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
Maximum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | YES | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3 mm | 3.9 mm | 3.9 mm |
Maximum write cycle time (tWC) | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms |
write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible |
JESD-609 code | e0 | e0 | e0 | - | e0 | e0 | e0 |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |