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FM25C040ULEM8X

Description
EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8
Categorystorage    storage   
File Size175KB,16 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
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FM25C040ULEM8X Overview

EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8

FM25C040ULEM8X Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFairchild
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clock frequency (fCLK)1 MHz
Data retention time - minimum40
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.9 mm
memory density4096 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.7/4.5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeSPI
Maximum standby current0.00001 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)4.5 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Maximum write cycle time (tWC)15 ms
write protectHARDWARE/SOFTWARE

FM25C040ULEM8X Related Products

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Description EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8
Parts packaging code SOIC SOIC SOIC DIP SOIC DIP SOIC
package instruction SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.25 DIP, DIP8,.3 TSSOP, TSSOP8,.25 PLASTIC, DIP-8 SOP, SOP8,.25
Contacts 8 8 8 8 8 8 8
Reach Compliance Code unknown unknown unknown unknown unknown compliant unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
Data retention time - minimum 40 40 40 40 40 40 40
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8
length 4.9 mm 4.9 mm 4.9 mm 9.817 mm 4.4 mm 9.817 mm 4.9 mm
memory density 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
word count 512 words 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C - - -40 °C
organize 512X8 512X8 512X8 512X8 512X8 512X8 512X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP DIP TSSOP DIP SOP
Encapsulate equivalent code SOP8,.25 SOP8,.25 SOP8,.25 DIP8,.3 TSSOP8,.25 DIP8,.3 SOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
power supply 2.7/4.5 V 2.7/4.5 V 2.7/4.5 V 2.7/4.5 V 2.7/4.5 V 2.7/4.5 V 2.7/4.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.75 mm 1.75 mm 5.08 mm 1.2 mm 5.08 mm 1.75 mm
Serial bus type SPI SPI SPI SPI SPI SPI SPI
Maximum standby current 0.00001 A 0.00001 A 0.000001 A 0.000001 A 0.00001 A 0.000001 A 0.00001 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 0.65 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 3.9 mm 3.9 mm 3.9 mm 7.62 mm 3 mm 7.62 mm 3.9 mm
Maximum write cycle time (tWC) 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Is it Rohs certified? incompatible incompatible incompatible - incompatible incompatible incompatible
JESD-609 code e0 e0 e0 - e0 e0 e0
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches - 1 1 1 1 - -

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