FM25C040ULZEN datasheet, PDF - EEWORLD Datasheet

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FM25C040ULZEN: DescriptionEEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8; Categorystorage storage; File Size175KB，16 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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FM25C040ULZEN Overview

EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8

FM25C040ULZEN Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum clock frequency (fCLK)	1 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8
length	9.817 mm
memory density	4096 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
power supply	2.7/4.5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Serial bus type	SPI
Maximum standby current	0.000001 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	4.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Maximum write cycle time (tWC)	15 ms
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

FM25C040ULZEN Related Products

	FM25C040ULZEN	FM25C040ULM8X	FM25C040ULZEM8X	FM25C040ULMT8X	FM25C040ULEM8X	FM25C040ULZN	FM25C040ULEM8
Description	EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8	EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8	EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8	EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8	EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8	EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8	EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8
Parts packaging code	DIP	SOIC	SOIC	SOIC	SOIC	DIP	SOIC
package instruction	DIP, DIP8,.3	SOP, SOP8,.25	SOP, SOP8,.25	TSSOP, TSSOP8,.25	SOP, SOP8,.25	PLASTIC, DIP-8	SOP, SOP8,.25
Contacts	8	8	8	8	8	8	8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	compliant	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz
Data retention time - minimum	40	40	40	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8
length	9.817 mm	4.9 mm	4.9 mm	4.4 mm	4.9 mm	9.817 mm	4.9 mm
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-40 °C	-	-40 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	TSSOP	SOP	DIP	SOP
Encapsulate equivalent code	DIP8,.3	SOP8,.25	SOP8,.25	TSSOP8,.25	SOP8,.25	DIP8,.3	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
power supply	2.7/4.5 V	2.7/4.5 V	2.7/4.5 V	2.7/4.5 V	2.7/4.5 V	2.7/4.5 V	2.7/4.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	1.75 mm	1.75 mm	1.2 mm	1.75 mm	5.08 mm	1.75 mm
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Maximum standby current	0.000001 A	0.00001 A	0.000001 A	0.00001 A	0.00001 A	0.000001 A	0.00001 A
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	YES	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	3.9 mm	3.9 mm	3 mm	3.9 mm	7.62 mm	3.9 mm
Maximum write cycle time (tWC)	15 ms	15 ms	15 ms	15 ms	15 ms	15 ms	15 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Base Number Matches	1	1	1	1	-	-	-
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
JESD-609 code	-	e0	e0	e0	e0	e0	e0
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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