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MS314001-100PC

Description
MASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size86KB,4 Pages
ManufacturerMosel Vitelic Corporation ( MVC )
Websitehttp://www.moselvitelic.com
Download Datasheet Parametric Compare View All

MS314001-100PC Overview

MASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

MS314001-100PC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMosel Vitelic Corporation ( MVC )
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.91 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.334 mm
Maximum standby current0.0001 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

MS314001-100PC Related Products

MS314001-100PC MS314001-150PC
Description MASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC )
Parts packaging code DIP DIP
package instruction DIP, DIP32,.6 DIP, DIP32,.6
Contacts 32 32
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 100 ns 150 ns
JESD-30 code R-PDIP-T32 R-PDIP-T32
JESD-609 code e0 e0
length 41.91 mm 41.91 mm
memory density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
memory width 8 8
Number of functions 1 1
Number of terminals 32 32
word count 524288 words 524288 words
character code 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 512KX8 512KX8
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP
Encapsulate equivalent code DIP32,.6 DIP32,.6
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 5.334 mm 5.334 mm
Maximum standby current 0.0001 A 0.0001 A
Maximum slew rate 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm

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