KM23C4100AFP1-20 datasheet, PDF

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KM23C4100AFP1-20: DescriptionMASK ROM, 512KX8, 200ns, CMOS, CQFP44, 14 X 14 MM, QFP-44; Categorystorage storage; File Size116KB，5 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM23C4100AFP1-20 Overview

MASK ROM, 512KX8, 200ns, CMOS, CQFP44, 14 X 14 MM, QFP-44

KM23C4100AFP1-20 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	QFP
package instruction	WQFP, QFP44,.7SQ,32
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	200 ns
Spare memory width	16
JESD-30 code	S-CQFP-G44
JESD-609 code	e0
length	14 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	44
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQFP
Encapsulate equivalent code	QFP44,.7SQ,32
Package shape	SQUARE
Package form	FLATPACK, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.8 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

KM23C4100AFP1-20 Related Products

	KM23C4100AFP1-20	KM23C4100A-20	KM23C4100AFP1-25	KM23C4100A-25	KM23C4100AFP2-15	KM23C4100AFP1-15	KM23C4100AFP2-20	KM23C4100A-15	KM23C4100AFP2-25
Description	MASK ROM, 512KX8, 200ns, CMOS, CQFP44, 14 X 14 MM, QFP-44	MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 512KX8, 250ns, CMOS, CQFP44, 14 X 14 MM, QFP-44	MASK ROM, 512KX8, 250ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 10 X 10 MM, QFP-44	MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 14 X 14 MM, QFP-44	MASK ROM, 512KX8, 200ns, CMOS, CQFP44, 10 X 10 MM, QFP-44	MASK ROM, 512KX8, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 512KX8, 250ns, CMOS, CQFP44, 10 X 10 MM, QFP-44
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFP	DIP	QFP	DIP	QFP	QFP	QFP	DIP	QFP
package instruction	WQFP, QFP44,.7SQ,32	DIP, DIP40,.6	WQFP, QFP44,.7SQ,32	DIP, DIP40,.6	WQFP, TQFP44,.6SQ,32	WQFP, QFP44,.7SQ,32	WQFP, TQFP44,.6SQ,32	DIP, DIP40,.6	WQFP, TQFP44,.6SQ,32
Contacts	44	40	44	40	44	44	44	40	44
Reach Compliance Code	unknown	unknown	compliant	compliant	unknown	unknown	unknown	unknown	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	200 ns	200 ns	250 ns	250 ns	150 ns	150 ns	200 ns	150 ns	250 ns
Spare memory width	16	16	16	16	16	16	16	16	16
JESD-30 code	S-CQFP-G44	R-PDIP-T40	S-CQFP-G44	R-PDIP-T40	S-CQFP-G44	S-CQFP-G44	S-CQFP-G44	R-PDIP-T40	S-CQFP-G44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	14 mm	52.43 mm	14 mm	52.43 mm	10 mm	14 mm	10 mm	52.43 mm	10 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bi
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	44	40	44	40	44	44	44	40	44
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQFP	DIP	WQFP	DIP	WQFP	WQFP	WQFP	DIP	WQFP
Encapsulate equivalent code	QFP44,.7SQ,32	DIP40,.6	QFP44,.7SQ,32	DIP40,.6	TQFP44,.6SQ,32	QFP44,.7SQ,32	TQFP44,.6SQ,32	DIP40,.6	TQFP44,.6SQ,32
Package shape	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE
Package form	FLATPACK, WINDOW	IN-LINE	FLATPACK, WINDOW	IN-LINE	FLATPACK, WINDOW	FLATPACK, WINDOW	FLATPACK, WINDOW	IN-LINE	FLATPACK, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	0.8 mm	2.54 mm	0.8 mm	2.54 mm	0.8 mm	0.8 mm	0.8 mm	2.54 mm	0.8 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	QUAD	QUAD	QUAD	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	15.24 mm	14 mm	15.24 mm	10 mm	14 mm	10 mm	15.24 mm	10 mm
Maker	SAMSUNG	SAMSUNG	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Maximum seat height	2.8 mm	5.08 mm	2.8 mm	5.08 mm	-	2.8 mm	-	5.08 mm	-

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