MASK ROM, 512KX8, 250ns, CMOS, CQFP44, 10 X 10 MM, QFP-44
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | QFP |
| package instruction | WQFP, TQFP44,.6SQ,32 |
| Contacts | 44 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum access time | 250 ns |
| Spare memory width | 16 |
| JESD-30 code | S-CQFP-G44 |
| JESD-609 code | e0 |
| length | 10 mm |
| memory density | 4194304 bi |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQFP |
| Encapsulate equivalent code | TQFP44,.6SQ,32 |
| Package shape | SQUARE |
| Package form | FLATPACK, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10 mm |
| KM23C4100AFP2-25 | KM23C4100A-20 | KM23C4100AFP1-25 | KM23C4100A-25 | KM23C4100AFP2-15 | KM23C4100AFP1-15 | KM23C4100AFP2-20 | KM23C4100AFP1-20 | KM23C4100A-15 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | MASK ROM, 512KX8, 250ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 512KX8, 250ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 250ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 | MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 200ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 | MASK ROM, 512KX8, 200ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | QFP | DIP | QFP | DIP | QFP | QFP | QFP | QFP | DIP |
| package instruction | WQFP, TQFP44,.6SQ,32 | DIP, DIP40,.6 | WQFP, QFP44,.7SQ,32 | DIP, DIP40,.6 | WQFP, TQFP44,.6SQ,32 | WQFP, QFP44,.7SQ,32 | WQFP, TQFP44,.6SQ,32 | WQFP, QFP44,.7SQ,32 | DIP, DIP40,.6 |
| Contacts | 44 | 40 | 44 | 40 | 44 | 44 | 44 | 44 | 40 |
| Reach Compliance Code | compli | unknown | compliant | compliant | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 250 ns | 200 ns | 250 ns | 250 ns | 150 ns | 150 ns | 200 ns | 200 ns | 150 ns |
| Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 code | S-CQFP-G44 | R-PDIP-T40 | S-CQFP-G44 | R-PDIP-T40 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 10 mm | 52.43 mm | 14 mm | 52.43 mm | 10 mm | 14 mm | 10 mm | 14 mm | 52.43 mm |
| memory density | 4194304 bi | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 44 | 40 | 44 | 40 | 44 | 44 | 44 | 44 | 40 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | WQFP | DIP | WQFP | DIP | WQFP | WQFP | WQFP | WQFP | DIP |
| Encapsulate equivalent code | TQFP44,.6SQ,32 | DIP40,.6 | QFP44,.7SQ,32 | DIP40,.6 | TQFP44,.6SQ,32 | QFP44,.7SQ,32 | TQFP44,.6SQ,32 | QFP44,.7SQ,32 | DIP40,.6 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| Package form | FLATPACK, WINDOW | IN-LINE | FLATPACK, WINDOW | IN-LINE | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 0.8 mm | 2.54 mm | 0.8 mm | 2.54 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10 mm | 15.24 mm | 14 mm | 15.24 mm | 10 mm | 14 mm | 10 mm | 14 mm | 15.24 mm |
| Maker | SAMSUNG | SAMSUNG | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
| Maximum seat height | - | 5.08 mm | 2.8 mm | 5.08 mm | - | 2.8 mm | - | 2.8 mm | 5.08 mm |
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