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CJ431(SOT89-3)

Description
Adjustable voltage stabilizing circuit
CategoryPower management   
File Size478KB,3 Pages
ManufacturerJCET
Websitehttp://www.cj-elec.com/

Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); ​​QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

 

 

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CJ431(SOT89-3) Overview

Adjustable voltage stabilizing circuit

Features

Product name: Adjustable voltage regulator circuit


Product model: CJ431(SOT89-3)


product features:


The output voltage can be adjusted to 36V


Low dynamic output impedance ,its typical value is 0.2Ω


Trapping current capability is 1 to 100mA


The typical value of the equivalent temperature factor in the whole temperature scope is 50 ppm/


The effective temperature compensation in the working range of full temperature


Low output noise voltage


Fast on -state response



Product parameters:


Pd power dissipation: 500mW


Io rectified current: 100mA


Vi Input voltage: -


VIROC :-


VO output voltage: VREF2.45~2.55V


Iq Quiescent Current: -



Package: SOT-89-3L

CJ431(SOT89-3) Preview

Download Datasheet
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
SOT-89-3L
Encapsulate Adjustable Reference Source
CJ431
Adjustable Accurate Reference Source
FEATURES
The output voltage can be adjusted to 36V
Low dynamic output impedance ,its typical value is
0.2Ω
Trapping current capability is 1 to
100mA
The typical value of the equivalent temperature factor in the
whole temperature scope is
50
ppm/
The effective temperature compensation in the working
range of full temperature
Low output noise voltage
Fast on -state response
SOT-89-3L
1.REFERENCE
2.ANODE
1
2
3
3.CATHODE
ABSOLUTE MAXIMUM RATINGS (Operating temperature range applies unlessotherwise specified)
Parameter
Cathode Voltage
Cathode Current Range (Continuous)
Reference lnput Current Range
Power Dissipation
Symbol
V
KA
I
KA
Iref
P
D
R
θJA
Topr
Tstg
Value
37
-100-+150
0.05-+10
500
Units
V
mA
mA
mW
Thermal Resistance from Junction to Ambient
Operating temperature
Storage temperature Range
250
0-70
-65-+150
℃/W
ELECTRICAL CHARACTERISTICS (T
a
=25
unless otherwise specified)
Parameter
Reference lnput Voltage
Deviation of reference input Voltage
Over temperature (note)
Ratio Of Change in Reference lnput
Voltage to the change in Cathode
Voltage
Reference lnput Current
Deviation Of Reference lnput Current
Over Full Temperature Range
Minimum cathode current for
regulation
Off-state cathode Current
Dynamic lmpedance
Symbol
V
ref
V
ref
/
T
Test
conditions
Min
2.450
Typ
2.5
4.5
-1.0
-0.5
1.5
0.4
0.45
0.05
0.15
Max
2.550
17
-2.7
-2.0
4
1.2
1.0
1.0
0.5
U
nit
V
mV
mV/V
mV/V
μA
μA
mA
μA
V
KA
=V
REF
, I
KA
=10mA
V
KA
=V
REF
, I
KA
=10mA
Tmin≤Ta≤Tmax
I
KA
=10mA
V
KA
=10V~V
REF
V
ref
/
V
KA
l
ref
l
ref
/
T
I
KA(min)
I
KA(OFF)
Z
KA
△V
KA
=36V~10V
I
KA
= 10mA,R
1
=10KΩ
R
2
=∞
l
KA
=10mA, R
1
=10KΩ
R
2
=∞
T
A
=full Temperature
V
KA
=V
REF
V
KA
=36V ,V
REF
=0
V
KA
=V
REF
, l
KA
=1 to 100mA
f≤1.0KHz
Note:T
MIN
=
0
,
T
MAX
=+
70
CLASSIFICATION OF V
ref
Rank
Range
0.5%
2.487-2.513
1%
2.475-2.525
2%
2.450-2.550
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