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AM29DL320GB90WMFN

Description
Flash, 2MX16, 90ns, PBGA48, 6 X 12 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Categorystorage    storage   
File Size1MB,58 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
Download Datasheet Parametric View All

AM29DL320GB90WMFN Overview

Flash, 2MX16, 90ns, PBGA48, 6 X 12 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48

AM29DL320GB90WMFN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instruction6 X 12 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time90 ns
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
JESD-609 codee1
length12 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size8,63
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.000005 A
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width6 mm
Am29DL320G
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not recommended for designs. For new and current designs,
S29JL032H (for TSOP packages) and S29PL032J (for FBGA packages) supersede AM29DL320G as
the factory-recommended migration path. Please refer to each respective datasheets for specifica-
tions and ordering information. Availability of this document is retained for reference and historical
purposes only.
April 2005
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that
originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appro-
priate, and changes will be noted in a revision summary.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number
25769
Revision
C
Amendment
+3
Issue Date
May 25, 2005
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