DM75S07AJ datasheet, PDF - EEWORLD Datasheet

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DM75S07AJ: DescriptionIC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC; Categorystorage storage; File Size240KB，8 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM75S07AJ Overview

IC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC

DM75S07AJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP16,.3
Reach Compliance Code	compliant
Maximum access time	30 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Memory IC Type	STANDARD SRAM
memory width	4
Number of terminals	16
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum slew rate	0.1 mA
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	IC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC	IC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC	IC,SRAM,16X4,S-TTL,DIP,16PIN,PLASTIC	IC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC	IC,SRAM,16X4,S-TTL,DIP,16PIN,PLASTIC	IC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC	IC,SRAM,16X4,S-TTL,DIP,16PIN,PLASTIC	IC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	30 ns	35 ns	35 ns	25 ns	25 ns	35 ns	35 ns	50 ns
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4	4
Number of terminals	16	16	16	16	16	16	16	16
word count	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C
organize	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4
Output characteristics	3-STATE	OPEN-COLLECTOR	OPEN-COLLECTOR	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum slew rate	0.1 mA	-	-	0.1 mA	0.1 mA	0.1 mA	0.1 mA	0.1 mA
Base Number Matches	-	1	1	1	1	1	1	-

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