256X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
Parts packaging code | DIP |
package instruction | DIP, DIP16,.3 |
Contacts | 16 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 65 ns |
JESD-30 code | R-GDIP-T16 |
length | 19.56 mm |
memory density | 1024 bit |
Memory IC Type | OTP ROM |
memory width | 4 |
Number of functions | 1 |
Number of terminals | 16 |
word count | 256 words |
character code | 256 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256X4 |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | BIPOLAR |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
TBP24SA10J | TBP24S41N | TBP24S81N | TBP24SA10N | TBP24S81J | |
---|---|---|---|---|---|
Description | 256X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16 | 1KX4 OTPROM, 60ns, PDIP18, 0.300 INCH, DIP-18 | 2KX4 OTPROM, 70ns, PDIP18, 0.300 INCH, DIP-18 | 256X4 OTPROM, 65ns, PDIP16, DIP-16 | 2KX4 OTPROM, 70ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
Parts packaging code | DIP | DIP | DIP | DIP | DIP |
package instruction | DIP, DIP16,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP16,.3 | DIP, DIP18,.3 |
Contacts | 16 | 18 | 18 | 16 | 18 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 65 ns | 60 ns | 70 ns | 65 ns | 70 ns |
JESD-30 code | R-GDIP-T16 | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T16 | R-GDIP-T18 |
memory density | 1024 bit | 4096 bit | 8192 bit | 1024 bit | 8192 bit |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
memory width | 4 | 4 | 4 | 4 | 4 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 18 | 18 | 16 | 18 |
word count | 256 words | 1024 words | 2048 words | 256 words | 2048 words |
character code | 256 | 1000 | 2000 | 256 | 2000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 256X4 | 1KX4 | 2KX4 | 256X4 | 2KX4 |
Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP18,.3 | DIP18,.3 | DIP16,.3 | DIP18,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
length | 19.56 mm | 22.48 mm | 22.48 mm | 19.305 mm | - |
power supply | 5 V | 5 V | - | 5 V | - |
Maximum slew rate | 0.1 mA | - | 0.175 mA | 0.1 mA | 0.175 mA |