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Nano-earphones may be able to "hear" cell infections
According to foreign media reports, a gold sphere nano-earphone with a diameter of 60 nanometers has become the most sensitive listen...[Details]
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According to the "Regulation Conditions for Photovoltaic Inverter Manufacturing Industry" issued by the Ministry of Industry and Information Technology, the weighted efficiency of photovoltaic inver...[Details]
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DS18B20 is a commonly used temperature test chip. It has the advantages of miniaturization, low power consumption, high performance, and strong anti-interference. At the same time, it can direct...[Details]
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CAN L is short-circuited to the power supply (positive pole)
When a fault such as CAN L short-circuiting the power supply (positive pole) occurs, depending on the fault-tolerant characteristic...[Details]
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SMIC released its unaudited results for the three months ended March 31, 2019. SMIC's sales in the first quarter of 2019 were US$668.9 million, a slight decline from US$787.6 million in the fourth qu...[Details]
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Recently, the Henan Provincial People's Government issued the "Implementation Plan for Henan Province to Implement a Package of Policies and Measures to Stabilize the Economy", which mentioned:
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Features of KM864807CH
1. Multi-protocol bidirectional timer
KM864807CH is a multi-protocol bidirectional timer for USB Type-C cables. We provide a PC retimer solution that can send...[Details]
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Beijing time, April 15 evening news, according to Reuters, Apple and its allies will attend a trial against chip supplier Qualcomm in San Diego on Monday. The lawsuit accuses Qualcomm of engaging in ...[Details]
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The installation position of the split electromagnetic flowmeter should be far away from industrial electromagnetic interference sources, such as high-power motors, transformers, etc. Otherwise, the s...[Details]
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At present, there are mainly the following design methods for microwave power amplifiers:
(1) Dynamic impedance measurement method. Under actual working conditions, use an instrument to meas...[Details]
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SiP system-level packaging technology is an important means of miniaturizing electronic systems and is becoming a hot spot in the current development of electronic technology. Compared with SoC, SiP ...[Details]
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On September 23, the 5-day 23rd China International Expo came to a successful conclusion at the National Exhibition & Convention Center (Shanghai). With the theme of "Industrial Collaboration, Safe...[Details]
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The power module combines most of the necessary components to provide a plug-and-play solution, replacing more than 40 different components. This integration simplifies and speeds up the design of ...[Details]
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In terms of data storage type, the 8051 series has on-chip and off-chip program memory, on-chip and off-chip data memory. The on-chip program memory is also divided into direct addressing area and in...[Details]
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To drive more than one high-brightness white LED, design engineers need to choose whether to connect the LEDs in series or in parallel. Of course, each connection method introduces design compromises....[Details]
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