Field Programmable Gate Array, 100MHz, 1377-Cell, CMOS, PBGA313
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
Reach Compliance Code | unknown |
maximum clock frequency | 100 MHz |
JESD-30 code | S-PBGA-B313 |
Number of entries | 228 |
Number of logical units | 1377 |
Output times | 228 |
Number of terminals | 313 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA313,25X25,50 |
Package shape | SQUARE |
Package form | GRID ARRAY |
power supply | 5 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
A14V100BP-BG313C | A1280A-1PG176E | A1280A-PG176E | A1280A-CQ172E | A1020B-PG84E | A1020B-1PG84E | A1020B-1CQ84E | A1280A-1CQ172E | A1020B-CQ84E | A14100A-STDCQ256B | |
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Description | Field Programmable Gate Array, 100MHz, 1377-Cell, CMOS, PBGA313 | Field Programmable Gate Array, 1232 CLBs, 8000 Gates, 60MHz, CMOS, CPGA176, CERAMIC, PGA-176 | Field Programmable Gate Array, 1232 CLBs, 8000 Gates, 41MHz, CMOS, CPGA176, CERAMIC, PGA-176 | Field Programmable Gate Array, 41MHz, 1232-Cell, CMOS, CQFP172 | Field Programmable Gate Array, 37MHz, 547-Cell, CMOS, CPGA84 | Field Programmable Gate Array, 44MHz, 547-Cell, CMOS, CPGA84 | Field Programmable Gate Array, 44MHz, 547-Cell, CMOS, CQFP84 | Field Programmable Gate Array, 1232 CLBs, 8000 Gates, 60MHz, CMOS, CQFP172, CAVITY-UP, CERAMIC, QFP-172 | Field Programmable Gate Array, 37MHz, 547-Cell, CMOS, CQFP84 | Field Programmable Gate Array |
Reach Compliance Code | unknown | compliant | compliant | compliant | unknown | unknown | unknown | compliant | unknow | compli |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
Maker | Microsemi | - | - | - | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
maximum clock frequency | 100 MHz | 60 MHz | 41 MHz | 41 MHz | 37 MHz | 44 MHz | 44 MHz | 60 MHz | 37 MHz | - |
JESD-30 code | S-PBGA-B313 | S-CPGA-P176 | S-CPGA-P176 | S-XQFP-F172 | S-XPGA-P84 | S-XPGA-P84 | S-XQFP-F84 | S-CQFP-F172 | S-XQFP-F84 | - |
Number of entries | 228 | - | - | 140 | 69 | 69 | 69 | - | 69 | - |
Number of logical units | 1377 | - | - | 1232 | 547 | 547 | 547 | - | 547 | - |
Output times | 228 | - | - | 140 | 69 | 69 | 69 | - | 69 | - |
Number of terminals | 313 | 176 | 176 | 172 | 84 | 84 | 84 | 172 | 84 | - |
Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC | - |
encapsulated code | BGA | PGA | PGA | GQFF | PGA | PGA | GQFF | GQFF | GQFF | - |
Encapsulate equivalent code | BGA313,25X25,50 | - | - | TPAK172,2.5SQ,25 | PGA84M,11X11 | PGA84M,11X11 | TPAK84,1.63SQ,25 | - | TPAK84,1.63SQ,25 | - |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, GUARD RING | GRID ARRAY | GRID ARRAY | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING | - |
power supply | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | - | 5 V | - |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | - |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
surface mount | YES | NO | NO | YES | NO | NO | YES | YES | YES | - |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
Terminal form | BALL | PIN/PEG | PIN/PEG | FLAT | PIN/PEG | PIN/PEG | FLAT | FLAT | FLAT | - |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 0.635 mm | 2.54 mm | 2.54 mm | 0.635 mm | 0.635 mm | 0.635 mm | - |
Terminal location | BOTTOM | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD | - |
package instruction | - | PGA, | PGA, | GQFF, TPAK172,2.5SQ,25 | PGA, PGA84M,11X11 | PGA, PGA84M,11X11 | GQFF, TPAK84,1.63SQ,25 | GQFF, | GQFF, TPAK84,1.63SQ,25 | , |