CY7C1019D-10ZXC datasheet, PDF

Datasheet> All Categories > storage> storage> CY7C1019D-10ZXC

CY7C1019D-10ZXC: DescriptionStandard SRAM, 128KX8, 10ns, CMOS, PDSO32, LEAD FREE, TSOP2-32; Categorystorage storage; File Size196KB，9 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

Download Datasheet Parametric Compare View All

CY7C1019D-10ZXC Overview

Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, LEAD FREE, TSOP2-32

CY7C1019D-10ZXC Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Cypress Semiconductor
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP32,.46
Contacts	32
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	10 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e3
length	20.95 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP32,.46
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.003 A
Minimum standby current	4.5 V
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
width	10.16 mm

Preview

Download Datasheet

View All

PRELIMINARY

CY7C1019D

1-Mbit (128K x 8) Static RAM

Features

• Pin- and function-compatible with CY7C1019B

• High speed

— t

= 10 ns

• CMOS for optimum speed/power

• Low active power

— I

= 60 mA @ 10 ns

• Low CMOS standby power

— I

SB2

= 1.2 mA (‘L’ Version only)

• Data Retention at 2.0V

• Center power/ground pinout

• Automatic power-down when deselected

• Easy memory expansion with CE and OE options

• Functionally equivalent to CY7C1019B

• Available in Pb-Free Packages

Functional Description

[1]

The CY7C1019D is a high-performance CMOS static RAM

organized as 131,072 words by 8 bits. Easy memory

expansion is provided by an active LOW Chip Enable (CE), an

active LOW Output Enable (OE), and tri-state drivers. This

device has an automatic power-down feature that significantly

reduces power consumption when deselected.

Writing to the device is accomplished by taking Chip Enable

(CE) and Write Enable (WE) inputs LOW. Data on the eight

I/O pins (I/O

through I/O

) is then written into the location

specified on the address pins (A

through A

Reading from the device is accomplished by taking Chip

Enable (CE) and Output Enable (OE) LOW while forcing Write

Enable (WE) HIGH. Under these conditions, the contents of

the memory location specified by the address pins will appear

on the I/O pins.

The eight input/output pins (I/O

through I/O

) are placed in a

high-impedance state when the device is deselected (CE

HIGH), the outputs are disabled (OE HIGH), or during a write

operation (CE LOW, and WE LOW).

The CY7C1019D is available in standard 32-pin TSOP Type

II and 400-mil-wide SOJ Pb-Free packages.

Logic Block Diagram

Pin Configurations

SOJ /TSOPII

Top View

I/O

INPUT BUFFER

I/O

ROW DECODER

I/O

SENSE AMPS

512 x 256 x 8

ARRAY

I/O

COLUMN

DECODER

POWER

DOWN

I/O

Note:

1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.

Cypress Semiconductor Corporation

Document #: 38-05464 Rev. *C

•

3901 North First Street

•

San Jose

CA 95134

•

408-943-2600

Revised January 11, 2005

CY7C1019D-10ZXC Related Products

	CY7C1019D-10ZXC	CY7C1019D-12ZXC	CY7C1019D-12VXC	CY7C1019D-12VXI	CY7C1019D-10VXC	CY7C1019D-10ZXI	CY7C1019D-12ZXI
Description	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, LEAD FREE, TSOP2-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, LEAD FREE, TSOP2-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, LEAD FREE, SOJ-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, LEAD FREE, SOJ-32	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, LEAD FREE, SOJ-32	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, LEAD FREE, TSOP2-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, LEAD FREE, TSOP2-32
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	TSOP2	TSOP2	SOJ	SOJ	SOJ	TSOP2	TSOP2
package instruction	TSOP2, TSOP32,.46	TSOP2, TSOP32,.46	SOJ, SOJ32,.44	SOJ, SOJ32,.44	SOJ, SOJ32,.44	TSOP2, TSOP32,.46	TSOP2, TSOP32,.46
Contacts	32	32	32	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	10 ns	12 ns	12 ns	12 ns	10 ns	10 ns	12 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e3	e3	e4	e4	e4	e3	e3
length	20.95 mm	20.95 mm	20.955 mm	20.955 mm	20.955 mm	20.95 mm	20.95 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8
Humidity sensitivity level	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C	70 °C	85 °C	85 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	SOJ	SOJ	SOJ	TSOP2	TSOP2
Encapsulate equivalent code	TSOP32,.46	TSOP32,.46	SOJ32,.44	SOJ32,.44	SOJ32,.44	TSOP32,.46	TSOP32,.46
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	3.7592 mm	3.7592 mm	3.7592 mm	1.2 mm	1.2 mm
Maximum standby current	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.06 mA	0.05 mA	0.05 mA	0.05 mA	0.06 mA	0.06 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	J BEND	J BEND	J BEND	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	20	20	20	20	20	20	20
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm

Recommended Resources

KT04 type is used in three-phase fully controlled bridge rectifier and speed regulation circuit

Electromechanical Control Differential Amplifier Circuit

Sensitive Photorelay Circuit

Relay control circuit

Pinout diagram of CD4013 and CD4514

Frequency characteristics of ultrasonic sensors

IoT APP Development: What should we pay attention to when developing IoT APP software?: As the current development trend of the Internet of Things, many companies have begun to focus on the big cake of the Internet of Things. If they want to achieve success in the development of the Inte...; zqy1111 RF/Wirelessly

Registration for ST 2021 Industrial Summit is now open!: ST 2021 Industrial Summit Summit date: November 3, 2021 (Wednesday) Summit Address: ShenzhenClick here to registerAs an industry benchmark, we are welcoming the third Industrial Summit this year. We s...; EEWORLD社区 ST Sensors & Low Power Wireless Technology Forum

Analyzing the interrupt behavior of gd32vf103 from the underlying principle of RISC-V: 1. Overview2. Interrupt vector table initialization3. Detailed analysis of irq_entry4. Understanding of the gd32vf103 interrupt programming model1. Overview When dealing with RISCv processor interrupt...; 天明 Domestic Chip Exchange

Digital frequency meter design: I want to design a frequency meter based on FPGA. There are programs for each module. They need to be created into a project file, which can be downloaded into fpga. If you can complete it, please pri...; 无名人 FPGA/CPLD

Audio Pre-Processing System Reference Design Using C5517: [i=s]This post was last edited by Jacktang on 2019-5-19 00:07[/i] [size=4]Audio Preprocessing System Reference Design Using C5517 Description This reference design uses multiple microphones, beamformi...; Jacktang DSP and ARM Processors

Complete breakdown, a conversation between a computer idiot and a hacker!: Hacker: I have controlled your computer. Xiaobai: How? Hacker: With a Trojan horse . Xiaobai: ... Where is it? I can't see it. Hacker: Open your task manager. Xiaobai: ... Where is the task manager? H...; soso Talking

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components