MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN8 3.0x2.0, 0.5P
CASE 517BU−01
ISSUE O
SCALE 4:1
D
A B
DATE 06 APR 2011
(0.065)
PIN 1
REFERENCE
E
(0.127)
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
b
D
D2
E
E2
e
L
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.20
0.30
2.00 BSC
1.35
1.45
3.00 BSC
0.85
0.95
0.50 BSC
0.35
0.45
0.15 C
0.15 C
0.05 C
A
0.05 C
NOTE 4
RECOMMENDED
MOUNTING FOOTPRINT
1.56
8X
0.63
PKG
OUTLINE
0.50
PITCH
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
©
Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DESCRIPTION: UDFN8 3.0 X 2.0, 0.5P
October, 2002
−
Rev. 0
PAGE 1 OF
XXX
2
1
DOCUMENT NUMBER:
ÍÍÍ
ÍÍÍ
ÍÍÍ
D2
1
8
TOP VIEW
DETAIL A
A1
SIDE VIEW
0.10
4
8X
M
C
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
XXX
ALL
YM
G
C A B
L
0.10
M
C A B
E2
5
8X
e
BOTTOM VIEW
b
0.10
0.05
XXX = Specific Device Code
A
= Assembly Location Code
LL = Assembly Lot
Y
= Year
M = Month
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “
G”,
may or may not be present.
M
M
C A B
C D
NOTE 3
1.06
3.30
1
0.32
DIMENSIONS: MILLIMETERS
8X
98AON55336E
DOCUMENT NUMBER:
98AON55336E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY V. CRACIUNOIU.
DATE
06 APR 2011
ON Semiconductor
and
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©
Semiconductor Components Industries, LLC, 2011
April, 2011
−
Rev. 01O
Case Outline Number:
517BU
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