HLMA-Qx00, HLMA-Px00 HLMT-Px00 and HLMT-Qx00
Subminiature High Performance AlInGaP LED Lamps
Data Sheet
SunPower Series
HLMA-PF00, HLMA-PG00, HLMA-PH00, HLMA-PL00, HLMA-QF00, HLMA-QG00, HLMA-QH00,
HLMA-QL00, HLMT-PG00, HLMT-PH00, HLMT-PL00, HLMT-QG00, HLMT-QH00, HLMT-QL00
Description
Flat Top Package
The HLMX-PXXX flat top lamps use an untinted, nondif-
fused, truncated lens to provide a wide radiation pattern
that is necessary for use in backlighting applications. The
flat top lamps are also ideal for use as emitters in light
pipe applications.
Features
x
Subminiature flat top package
Ideal for backlighting and light piping applications
x
Subminiature dome package
Nondiffused dome for high brightness
x
Wide range of drive currents
x
Colors: 590 nm Amber, 605 nm Orange, 615 nm Red-
dish-Orange, 622/626 nm Red, and 635 nm Red
x
Ideal for space limited applications
x
Axial leads
x
Available with lead configurations for surface mount
and through hole PC board mounting
Dome Packages
The HLMX-QXXX dome lamps use an untinted, nondif-
fused lens to provide a high luminous intensity within a
narrow radiation pattern.
Lead Configurations
All of these devices are made by encapsulating LED chips
on axial lead frames to form molded epoxy submini-
ature lamp packages. A variety of package configuration
options is available. These include special surface mount
lead configurations, gull wing, yoke lead, or Z-bend. Right
angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm
(0.200 inch) center spacing are available for through hole
mounting. For more information refer to Standard SMT
and Through Hole Lead Bend Options for Subminiature
LED Lamps data sheet.
Technology
These subminiature solid state lamps utilize one of the
two newly developed aluminum indium gallium phos-
phide (AlInGaP) LED technologies. The HLMT-Devices
are especially effective in very bright ambient lighting
conditions. The colors 590 nm amber, 605 nm orange,
615 nm reddish-orange, 622/626 nm red, and 635 nm red
are available with viewing angles of 15° for the domed
devices and 125° for the flat top devices.
Part Numbering System
HLMx - x x 00 - x x x xx
Packaging Option
00: Straight Leads, Bulk Packaging, Quantity of 500 parts
11: Gull Wing Bend, Tape & Reel – 7" Reel
12: Gull Wing Bend, Bulk
14: Gull Wing Bend, Tape & Reel – 13" Reel
21: Yoke Bend, Tape and Reel – 7" Reel
22: Yoke Bend, Bulk
24: Yoke Bend, Tape and Reel – 13" Reel
31: Z-Bend, Tape and Reel – 7" Reel
32: Z-Bend, Bulk
34: Z-Bend, Tape and Reel – 13" Reel
Color Bin Selection
0: Full Color Bin Distribution
B: Color Bins 2 & 3
K: Color Bins 2, 3 & 4
R: Color Bins 2 & 4
W: Color Bins 2, 4, 6 & 7
X: Color Bins 4, 6 & 7
Maximum Iv Bin Options
Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
L: Amber 590 nm
J: Orange 605 nm
H: Reddish Orange 615 nm
G: Red 622/626 nm
F: Red 635 nm
Package Options
Q: Dome
P: Flat Top
3
Absolute Maximum Ratings at T
A
= 25°C
Parameter
Peak Forward Current
[2]
Average Forward Current (I
PEAK
= 100 mA)
[1,2]
DC Forward Current
[3,5,6]
Power Dissipation
Reverse Voltage (I
R
= 100 μA)
Transient Forward Current (10 μs Pulse)
[5]
Operating Temperature Range
Storage Temperature Range
LED Junction Temperature
Lead Soldering Temperature [1.6 mm (0.063 in.) from body]
SMT Reflow Soldering Temperature
HLMA-xxxx
100
30
50
105
5
500
–40 to +100
–55 to +100
110
260°C for 5 seconds
260°C for 20 seconds
HLMT-xxxx
100
37
50
120
Unit
mA
mA
mA
mW
V
mA
°C
°C
°C
Notes:
1. Maximum I
AVG
at f = 1 kHz.
2. Refer to Figure 5 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 4.
4. The transient peak current is the maximum non-recurring peak current these devices can withstand without damaging the LED die and wire
bonds. Operation at currents above Absolute Maximum Peak Forward Current is not recommended.
5. Drive currents between 10 mA and 30 mA are recommended for best long term performance.
6. Operation at currents below 5 mA is not recommended, please contact your Avago sales representative.
CATHODE
TAB
NO. ANODE DOWN.
YES. CATHODE DOWN.
Proper right angle mounting to a PC board to prevent protruding cathode tab from shorting to anode connection.
5
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