CC430F5133IRGZ datasheet, PDF - EEWORLD Datasheet

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CC430F5133IRGZ: DescriptionSOC MSP430 48-Pin VQFN EP Tube; File Size1MB，120 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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CC430F5133IRGZ Overview

SOC MSP430 48-Pin VQFN EP Tube

CC430F5133IRGZ Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	5A992C
Part Status	Active
HTS	8542.31.00.01
Family Name	MSP430
Maximum Clock Rate (MHz)	20
Program Memory Type	Flash
Data Bus Width (bit)	16
Program Memory Size	8KB
RAM Size	2KB
Type	System-On-Chip
Processing Unit	Microcontroller
PWM	1
Watchdog	1
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Interface Type	I2C/IrDA/SPI/UART
SPI	2
I2C	1
I2S	0
UART	1
USB	0
USART	0
CAN	0
Ethernet	0
Programmability	Yes
Packaging	Tube
Supplier Package	VQFN EP
Pin Count	48
Standard Package Name	QFN
Mounting	Surface Mount
Package Height	0.95(Max)
Package Length	7.15(Max)
Package Width	7.15(Max)
PCB changed	48
Lead Shape	No Lead

CC430F5133IRGZ Related Products

	CC430F5133IRGZ	CC430F5137IRGZ	CC430F5135IRGZ	CC430F6125IRGC	CC430F6126IRGC	CC430F6135IRGC	CC430F6137IRGC
Description	SOC MSP430 48-Pin VQFN EP Tube	SOC MSP430 48-Pin VQFN EP Tube	SOC MSP430 48-Pin VQFN EP Tube	RF Microcontrollers - MCU 16B Ultra-Lo-Pwr MCU	RF Microcontrollers - MCU 16B Ultra-Lo-Pwr MCU 32KB Flash	RF Microcontrollers - MCU 16B Ultra-Lo-Pwr MCU 16KB Flash	RF Microcontrollers - MCU 16B Ultra-Lo-Pwr MCU 32KB Flash
Is it Rohs certified?	-	-	-	conform to	conform to	conform to	conform to
Parts packaging code	-	-	-	QFN	QFN	QFN	QFN
package instruction	-	-	-	GREEN, PLASTIC, VQFN-64	VQCCN,	GREEN, PLASTIC, VQFN-64	VQCCN,
Contacts	-	-	-	64	64	64	64
Reach Compliance Code	-	-	-	unknown	compli	unknown	unknow
JESD-30 code	-	-	-	S-PQCC-N64	S-PQCC-N64	S-PQCC-N64	S-PQCC-N64
length	-	-	-	9 mm	9 mm	9 mm	9 mm
Number of functions	-	-	-	1	1	1	1
Number of terminals	-	-	-	64	64	64	64
Maximum operating temperature	-	-	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	-	VQCCN	VQCCN	VQCCN	VQCCN
Package shape	-	-	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	-	-	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	-	-	-	260	NOT SPECIFIED	260	260
Certification status	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	-	-	1 mm	1 mm	1 mm	1 mm
Nominal supply voltage	-	-	-	2.2 V	2.2 V	2.2 V	2.2 V
surface mount	-	-	-	YES	YES	YES	YES
Telecom integrated circuit types	-	-	-	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	-	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	-	-	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	-	-	-	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	-	-	-	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	-	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	-	-	9 mm	9 mm	9 mm	9 mm
Base Number Matches	-	-	-	1	1	1	1

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