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AM29F400BB-55EE0

Description
Flash, 256KX16, 55ns, PDSO48, MO-142BDD, TSOP-48
Categorystorage    storage   
File Size857KB,43 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric View All

AM29F400BB-55EE0 Overview

Flash, 256KX16, 55ns, PDSO48, MO-142BDD, TSOP-48

AM29F400BB-55EE0 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
package instructionMO-142BDD, TSOP-48
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time55 ns
Other featuresBOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length18.4 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width12 mm
Am29F400B
Data Sheet
Am29F400B Cover Sheet
The following document contains information on Spansion memory products.
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been
made are the result of normal data sheet improvement and are noted in the document revision summary.
For More Information
Please contact your local sales office for additional information about Spansion memory solutions.
Publication Number
21505
Revision
E
Amendment
8
Issue Date
November 11, 2009
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