MSM7578VGS-K datasheet, PDF - EEWORLD Datasheet

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MSM7578VGS-K: DescriptionPCM Codec, A/MU-Law, 1-Func, CMOS, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24; CategoryWireless rf/communication Telecom circuit; File Size193KB，19 Pages; ManufacturerLAPIS Semiconductor Co., Ltd.

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MSM7578VGS-K Overview

PCM Codec, A/MU-Law, 1-Func, CMOS, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24

MSM7578VGS-K Parametric

Parameter Name	Attribute value
Maker	LAPIS Semiconductor Co., Ltd.
Parts packaging code	SOIC
package instruction	SOP,
Contacts	24
Reach Compliance Code	unknown
Law of compression and extension	A/MU-LAW
filter	YES
JESD-30 code	R-PDSO-G24
length	15.95 mm
Number of functions	1
Number of terminals	24
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum seat height	2.5 mm
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	PCM CODEC
Temperature level	OTHER
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	7.9 mm

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Dear customers,

About the change in the name such as "Oki Electric Industry Co. Ltd." and

"OKI" in documents to OKI Semiconductor Co., Ltd.

The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI

Semiconductor Co., Ltd. on October 1, 2008.

Therefore, please accept that although

the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"

remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".

It is a change of the company name, the company trademark, and the logo, etc. , and

NOT a content change in documents.

October 1, 2008

OKI Semiconductor Co., Ltd.

550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan

http://www.okisemi.com/en/

MSM7578VGS-K Related Products

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Description	PCM Codec, A/MU-Law, 1-Func, CMOS, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24	PCM Codec, MU-Law, 1-Func, CMOS, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24	PCM Codec, MU-Law, 1-Func, CMOS, PDSO20, 0.250 INCH, 0.95 MM PITCH, PLASTIC, SSOP-20	PCM Codec, MU-Law, 1-Func, CMOS, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16	PCM Codec, A/MU-Law, 1-Func, CMOS, PDSO20, 0.250 INCH, 0.95 MM PITCH, PLASTIC, SSOP-20	PCM Codec, A/MU-Law, 1-Func, CMOS, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16	PCM Codec, A-Law, 1-Func, CMOS, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24	PCM Codec, A-Law, 1-Func, CMOS, PDSO20, 0.250 INCH, 0.95 MM PITCH, PLASTIC, SSOP-20	PCM Codec, A-Law, 1-Func, CMOS, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16
Maker	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.
Parts packaging code	SOIC	SOIC	SSOP	DIP	SSOP	DIP	SOIC	SSOP	DIP
package instruction	SOP,	SOP,	SSOP, SOP20,.25,40	DIP, DIP16,.3	SSOP, SOP20,.25,40	DIP, DIP16,.3	SOP,	SSOP, SOP20,.25,40	DIP, DIP16,.3
Contacts	24	24	20	16	20	16	24	20	16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Law of compression and extension	A/MU-LAW	MU-LAW	MU-LAW	MU-LAW	A/MU-LAW	A/MU-LAW	A-LAW	A-LAW	A-LAW
filter	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PDSO-G24	R-PDSO-G24	R-PDSO-G20	R-PDIP-T16	R-PDSO-G20	R-PDIP-T16	R-PDSO-G24	R-PDSO-G20	R-PDIP-T16
length	15.95 mm	15.95 mm	10 mm	19.05 mm	10 mm	19.05 mm	15.95 mm	10 mm	19.05 mm
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	24	24	20	16	20	16	24	20	16
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SSOP	DIP	SSOP	DIP	SOP	SSOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	IN-LINE	SMALL OUTLINE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.5 mm	2.5 mm	2 mm	5.08 mm	2 mm	5.08 mm	2.5 mm	2 mm	5.08 mm
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	0.95 mm	2.54 mm	0.95 mm	2.54 mm	1.27 mm	0.95 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.9 mm	7.9 mm	5 mm	7.62 mm	5 mm	7.62 mm	7.9 mm	5 mm	7.62 mm
Is it Rohs certified?	-	-	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible
JESD-609 code	-	-	e0	e0	e0	e0	-	e0	e0
linear encoding	-	-	NOT AVAILABLE	NOT AVAILABLE	NOT AVAILABLE	NOT AVAILABLE	-	NOT AVAILABLE	NOT AVAILABLE
Encapsulate equivalent code	-	-	SOP20,.25,40	DIP16,.3	SOP20,.25,40	DIP16,.3	-	SOP20,.25,40	DIP16,.3
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	-	-	5 V	5 V	5 V	5 V	-	5 V	5 V
Maximum slew rate	-	-	0.009 mA	0.009 mA	0.009 mA	0.009 mA	-	0.009 mA	0.009 mA
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED

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