IS25C16-2ZI datasheet, PDF - EEWORLD Datasheet

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IS25C16-2ZI: DescriptionEEPROM, 2KX8, Serial, CMOS, PDSO8, 0.169 INCH, MO-153, TSSOP-8; Categorystorage storage; File Size182KB，19 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS25C16-2ZI Overview

EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.169 INCH, MO-153, TSSOP-8

IS25C16-2ZI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSSOP
package instruction	0.169 INCH, MO-153, TSSOP-8
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum clock frequency (fCLK)	10 MHz
JESD-30 code	R-PDSO-G8
JESD-609 code	e0
length	4.4 mm
memory density	16384 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	2048 words
character code	2000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.2 mm
Serial bus type	SPI
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm
Maximum write cycle time (tWC)	5 ms

IS25C16-2ZI Related Products

	IS25C16-2ZI	IS25C16-2DLI	IS25C16-2PLI	IS25C16-3PLA3	IS25C16-2PI	IS25C08-3PLA3	IS25C08-2DLI	IS25C08-2PLI	IS25C08-2ZI
Description	EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.169 INCH, MO-153, TSSOP-8	EEPROM, 2KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8	EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8	EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8	EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLATIC, DIP-8	EEPROM, 1KX8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8	EEPROM, 1KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8	EEPROM, 1KX8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, MO-153, TSSOP-8
Is it Rohs certified?	incompatible	conform to	conform to	conform to	incompatible	conform to	conform to	conform to	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSSOP	SON	DIP	DIP	DIP	DIP	SON	DIP	TSSOP
package instruction	0.169 INCH, MO-153, TSSOP-8	HVSON,	DIP,	DIP,	0.300 INCH, PLATIC, DIP-8	DIP,	HVSON,	DIP,	0.169 INCH, MO-153, TSSOP-8
Contacts	8	8	8	8	8	8	8	8	8
Reach Compliance Code	unknown	compliant	compliant	compliant	unknown	compliant	compliant	compliant	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz
JESD-30 code	R-PDSO-G8	R-XDSO-N8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-XDSO-N8	R-PDIP-T8	R-PDSO-G8
JESD-609 code	e0	e3	e3	e3	e0	e3	e3	e3	e0
length	4.4 mm	3 mm	9.365 mm	9.365 mm	9.365 mm	9.365 mm	3 mm	9.365 mm	4.4 mm
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8	8
Humidity sensitivity level	1	1	3	3	3	3	1	3	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8	8
word count	2048 words	2048 words	2048 words	2048 words	2048 words	1024 words	1024 words	1024 words	1024 words
character code	2000	2000	2000	2000	2000	1000	1000	1000	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	125 °C	85 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	1KX8	1KX8	1KX8	1KX8
Package body material	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	HVSON	DIP	DIP	DIP	DIP	HVSON	DIP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	260	NOT SPECIFIED	260	260	260	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	0.8 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	0.8 mm	4.57 mm	1.2 mm
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	2.5 V	1.8 V	2.5 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	5 V	2.5 V	5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	NO	NO	NO	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	GULL WING
Terminal pitch	0.65 mm	0.5 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	0.5 mm	2.54 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40	40	NOT SPECIFIED	40	40	40	NOT SPECIFIED
width	3 mm	2 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	2 mm	7.62 mm	3 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
Is it lead-free?	Contains lead	-	Lead free	Lead free	Contains lead	Lead free	-	Lead free	Contains lead

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