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MF1S5009

Description
Mainstream contactless smart card IC for fast and easy solution development
File Size218KB,32 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MF1S5009 Overview

Mainstream contactless smart card IC for fast and easy solution development

MF1S5009 Related Products

MF1S5009 MF1S5009DA4 MF1S5009DUD
Description Mainstream contactless smart card IC for fast and easy solution development Mainstream contactless smart card IC for fast and easy solution development Mainstream contactless smart card IC for fast and easy solution development
Maker - NXP NXP
Parts packaging code - SOT DIE
Reach Compliance Code - unknow unknow
ECCN code - EAR99 EAR99
Adjustable threshold - NO NO
Analog Integrated Circuits - Other Types - POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 code - R-PXMA-N R-XUUC-N
Number of channels - 1 1
Number of functions - 1 1
Maximum operating temperature - 70 °C 70 °C
Minimum operating temperature - -25 °C -25 °C
Package body material - PLASTIC/EPOXY UNSPECIFIED
Package shape - RECTANGULAR RECTANGULAR
Package form - MICROELECTRONIC ASSEMBLY UNCASED CHIP
Certification status - Not Qualified Not Qualified
surface mount - YES YES
Temperature level - OTHER OTHER
Terminal form - NO LEAD NO LEAD
Terminal location - UNSPECIFIED UPPER

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