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MF1S5009DA4

Description
Mainstream contactless smart card IC for fast and easy solution development
CategoryPower/power management    The power supply circuit   
File Size218KB,32 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MF1S5009DA4 Overview

Mainstream contactless smart card IC for fast and easy solution development

MF1S5009DA4 Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeSOT
package instruction,
Contacts2
Manufacturer packaging codeSOT500-2
Reach Compliance Codeunknow
ECCN codeEAR99
Adjustable thresholdNO
Analog Integrated Circuits - Other TypesPOWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 codeR-PXMA-N
Number of channels1
Number of functions1
Maximum operating temperature70 °C
Minimum operating temperature-25 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
surface mountYES
Temperature levelOTHER
Terminal formNO LEAD
Terminal locationUNSPECIFIED

MF1S5009DA4 Related Products

MF1S5009DA4 MF1S5009 MF1S5009DUD
Description Mainstream contactless smart card IC for fast and easy solution development Mainstream contactless smart card IC for fast and easy solution development Mainstream contactless smart card IC for fast and easy solution development
Maker NXP - NXP
Parts packaging code SOT - DIE
Reach Compliance Code unknow - unknow
ECCN code EAR99 - EAR99
Adjustable threshold NO - NO
Analog Integrated Circuits - Other Types POWER SUPPLY MANAGEMENT CIRCUIT - POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 code R-PXMA-N - R-XUUC-N
Number of channels 1 - 1
Number of functions 1 - 1
Maximum operating temperature 70 °C - 70 °C
Minimum operating temperature -25 °C - -25 °C
Package body material PLASTIC/EPOXY - UNSPECIFIED
Package shape RECTANGULAR - RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY - UNCASED CHIP
Certification status Not Qualified - Not Qualified
surface mount YES - YES
Temperature level OTHER - OTHER
Terminal form NO LEAD - NO LEAD
Terminal location UNSPECIFIED - UPPER
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