MF1S5009DUD datasheet, PDF - EEWORLD Datasheet

MF1S5009DUD: DescriptionMainstream contactless smart card IC for fast and easy solution development; CategoryPower/power management The power supply circuit; File Size218KB，32 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MF1S5009DUD Overview

Mainstream contactless smart card IC for fast and easy solution development

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIE
package instruction	DIE,
Reach Compliance Code	unknow
ECCN code	EAR99
Adjustable threshold	NO
Analog Integrated Circuits - Other Types	POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 code	R-XUUC-N
Number of channels	1
Number of functions	1
Maximum operating temperature	70 °C
Minimum operating temperature	-25 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Certification status	Not Qualified
surface mount	YES
Temperature level	OTHER
Terminal form	NO LEAD
Terminal location	UPPER

	MF1S5009DUD	MF1S5009DA4	MF1S5009
Description	Mainstream contactless smart card IC for fast and easy solution development	Mainstream contactless smart card IC for fast and easy solution development	Mainstream contactless smart card IC for fast and easy solution development
Maker	NXP	NXP	-
Parts packaging code	DIE	SOT	-
Reach Compliance Code	unknow	unknow	-
ECCN code	EAR99	EAR99	-
Adjustable threshold	NO	NO	-
Analog Integrated Circuits - Other Types	POWER SUPPLY MANAGEMENT CIRCUIT	POWER SUPPLY MANAGEMENT CIRCUIT	-
JESD-30 code	R-XUUC-N	R-PXMA-N	-
Number of channels	1	1	-
Number of functions	1	1	-
Maximum operating temperature	70 °C	70 °C	-
Minimum operating temperature	-25 °C	-25 °C	-
Package body material	UNSPECIFIED	PLASTIC/EPOXY	-
Package shape	RECTANGULAR	RECTANGULAR	-
Package form	UNCASED CHIP	MICROELECTRONIC ASSEMBLY	-
Certification status	Not Qualified	Not Qualified	-
surface mount	YES	YES	-
Temperature level	OTHER	OTHER	-
Terminal form	NO LEAD	NO LEAD	-
Terminal location	UPPER	UNSPECIFIED	-

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