MSC2310-12YS9 datasheet, PDF - EEWORLD Datasheet

MSC2310-12YS9: DescriptionPage Mode DRAM, 1MX9, 120ns, MOS, CSMA30; Categorystorage storage; File Size816KB，12 Pages; ManufacturerLAPIS Semiconductor Co., Ltd.

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MSC2310-12YS9 Overview

Page Mode DRAM, 1MX9, 120ns, MOS, CSMA30

Parameter Name	Attribute value
Maker	LAPIS Semiconductor Co., Ltd.
package instruction	SIMM, SIM30
Reach Compliance Code	unknown
Maximum access time	120 ns
I/O type	COMMON
JESD-30 code	R-XSMA-N30
memory density	9437184 bit
Memory IC Type	PAGE MODE DRAM
memory width	9
Number of terminals	30
word count	1048576 words
character code	1000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX9
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	SIMM
Encapsulate equivalent code	SIM30
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
refresh cycle	512
Maximum slew rate	0.63 mA
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	2.54 mm
Terminal location	SINGLE

	MSC2310-12YS9	MSC2310-10YS9
Description	Page Mode DRAM, 1MX9, 120ns, MOS, CSMA30	Page Mode DRAM, 1MX9, 100ns, MOS, CSMA30
Maker	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.
package instruction	SIMM, SIM30	SIMM, SIM30
Reach Compliance Code	unknown	unknown
Maximum access time	120 ns	100 ns
I/O type	COMMON	COMMON
JESD-30 code	R-XSMA-N30	R-XSMA-N30
memory density	9437184 bit	9437184 bit
Memory IC Type	PAGE MODE DRAM	PAGE MODE DRAM
memory width	9	9
Number of terminals	30	30
word count	1048576 words	1048576 words
character code	1000000	1000000
Maximum operating temperature	70 °C	70 °C
organize	1MX9	1MX9
Output characteristics	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC
encapsulated code	SIMM	SIMM
Encapsulate equivalent code	SIM30	SIM30
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified
refresh cycle	512	512
Maximum slew rate	0.63 mA	0.675 mA
surface mount	NO	NO
technology	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE

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