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AM29SL160CT100WCI

Description
2MX8 FLASH 1.8V PROM, 100ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
Categorystorage    storage   
File Size938KB,49 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

AM29SL160CT100WCI Overview

2MX8 FLASH 1.8V PROM, 100ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48

AM29SL160CT100WCI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instruction8 X 9 MM, 0.80 MM PITCH, FBGA-48
Contacts48
Reach Compliance Codecompliant
Maximum access time100 ns
Spare memory width16
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length9 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.2 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width8 mm
Am29SL160C
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
CMOS 1.8 Volt-only Super Low Voltage Flash Memory
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
s
Secured Silicon (SecSi) Sector: 256-byte sector
Factory locked and identifiable:
16 bytes available for
secure, random factory Electronic Serial Number;
verifiable as factory locked through autoselect
function. ExpressFlash option allows entire sector to
be available for factory-secured data
Customer lockable:
Customer may program own
custom data. Once locked, data cannot be changed
s
Zero Power Operation
— Sophisticated power management circuits reduce
power consumed during inactive periods to nearly
zero
s
Package options
— 48-ball FBGA
— 48-pin TSOP
s
Top or bottom boot block
s
Manufactured on 0.32 µm process technology
s
Compatible with JEDEC standards
— Pinout and software compatible with single-power-
supply flash standard
PERFORMANCE CHARACTERISTICS
s
High performance
— Access time as fast 90 ns
— Program time: 8 µs/word typical using Accelerate
s
Ultra low power consumption (typical values)
— 1 mA active read current at 1 MHz
— 5 mA active read current at 5 MHz
— 1 µA in standby or automatic sleep mode
s
Minimum 1 million erase cycles guaranteed per
sector
s
20 Year data retention at 125°C
— Reliable operation for the life of the system
SOFTWARE FEATURES
s
Supports Common Flash Memory Interface (CFI)
s
Erase Suspend/Erase Resume
— Suspends erase operations to allow programming in
same bank
s
Data# Polling and Toggle Bits
— Provides a software method of detecting the status of
program or erase cycles
s
Unlock Bypass Program command
— Reduces overall programming time when issuing
multiple program command sequences
HARDWARE FEATURES
s
Any combination of sectors can be erased
s
Ready/Busy# output (RY/BY#)
— Hardware method for detecting program or erase
cycle completion
s
Hardware reset pin (RESET#)
— Hardware method of resetting the internal state
machine to reading array data
s
WP#/ACC input pin
— Write protect (WP#) function allows protection of two
outermost boot sectors, regardless of sector protect status
— Acceleration (ACC) function accelerates program
timing
s
Sector protection
— Hardware method of locking a sector, either in-
system or using programming equipment, to prevent
any program or erase operation within that sector
— Temporary Sector Unprotect allows changing data in
protected sectors in-system
Publication#
21635
Rev:
C
Amendment/0
Issue Date:
February 21, 2000
Refer to AMD’s Website (www.amd.com) for the latest information.
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