Flash Module, 4MX16, 120ns, CPGA50, DENSE STACK, MODULE, HERMETIC SEALED, PGA-50
Parameter Name | Attribute value |
Maker | B&B Electronics Manufacturing Company |
Parts packaging code | PGA |
package instruction | DENSE STACK, MODULE, HERMETIC SEALED, PGA-50 |
Contacts | 50 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 120 ns |
Other features | AUTOMATIC WRITE |
JESD-30 code | R-CPGA-P50 |
length | 25.146 mm |
memory density | 67108864 bit |
Memory IC Type | FLASH MODULE |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 50 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 4MX16 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | APGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, PIGGYBACK |
Parallel/Serial | PARALLEL |
Programming voltage | 12 V |
Certification status | Not Qualified |
Maximum seat height | 21.0312 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | MOS |
Temperature level | MILITARY |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
type | NOR TYPE |
width | 13.716 mm |