|
IS22C011X |
IS22C011XI |
IS22C011S |
IS22C011SI |
Description |
Speech Synthesizer, 12.8s, DIE-15 |
Speech Synthesizer, 12.8s, DIE-16 |
Speech Synthesizer, 12.8s, CMOS, PDSO16, 0.300 INCH, PLASTIC, SOP-16 |
Speech Synthesizer, 12.8s, CMOS, PDSO16, 0.300 INCH, PLASTIC, SOP-16 |
Maker |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Parts packaging code |
DIE |
DIE |
SOIC |
SOIC |
package instruction |
DIE, |
DIE, |
0.300 INCH, PLASTIC, SOP-16 |
0.300 INCH, PLASTIC, SOP-16 |
Contacts |
15 |
16 |
16 |
16 |
Reach Compliance Code |
unknown |
unknown |
compliant |
compliant |
application |
GREETING CARDS |
GREETING CARD |
GREETING CARDS |
GREETING CARD |
Commercial integrated circuit types |
SPEECH SYNTHESIZER |
SPEECH SYNTHESIZER |
SPEECH SYNTHESIZER |
SPEECH SYNTHESIZER |
JESD-30 code |
R-XUUC-N15 |
R-XUUC-N16 |
R-PDSO-G16 |
R-PDSO-G16 |
Number of terminals |
15 |
16 |
16 |
16 |
On-chip memory type |
ONE TIME PROGRAMMABLE ROM |
ONE TIME PROGRAMMABLE ROM |
ONE TIME PROGRAMMABLE ROM |
ONE TIME PROGRAMMABLE ROM |
Maximum operating temperature |
70 °C |
85 °C |
70 °C |
85 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIE |
DIE |
SOP |
SOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
UNCASED CHIP |
UNCASED CHIP |
SMALL OUTLINE |
SMALL OUTLINE |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum read time |
12.8 s |
12.8 s |
12.8 s |
12.8 s |
Maximum supply voltage (Vsup) |
6 V |
6 V |
6 V |
6 V |
Minimum supply voltage (Vsup) |
2.4 V |
2.4 V |
2.4 V |
2.4 V |
surface mount |
YES |
YES |
YES |
YES |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal form |
NO LEAD |
NO LEAD |
GULL WING |
GULL WING |
Terminal location |
UPPER |
UPPER |
DUAL |
DUAL |