Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72
Parameter Name | Attribute value |
Parts packaging code | SIMM |
package instruction | , |
Contacts | 72 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 60 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 code | R-XSMA-N72 |
memory density | 268435456 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 72 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8MX32 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | SINGLE |
Base Number Matches | 1 |
KMM5328100CSG-6 | KMM5328100CS-5 | KMM5328000CSG-6 | KMM5328000CSG-5 | KMM5328100CS-6 | KMM5328000CS-6 | KMM5328100CSG-5 | KMM5328000CS-5 | |
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Description | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 |
Parts packaging code | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
Contacts | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
Maximum access time | 60 ns | 50 ns | 60 ns | 50 ns | 60 ns | 60 ns | 50 ns | 50 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 code | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
memory density | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bi |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
word count | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
character code | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Maker | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |