OTP ROM, 8KX8, 65ns, Bipolar, CDIP24, 0.600 INCH, CERAMIC, DIP-24
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | DIP |
package instruction | DIP, DIP24,.6 |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 65 ns |
JESD-30 code | R-GDIP-T24 |
JESD-609 code | e0 |
length | 32.0675 mm |
memory density | 65536 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum seat height | 5.588 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | BIPOLAR |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |