EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

AS7C251MFT32A-65TQI

Description
Standard SRAM, 1MX32, 6.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Categorystorage    storage   
File Size578KB,23 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Download Datasheet Parametric View All

AS7C251MFT32A-65TQI Overview

Standard SRAM, 1MX32, 6.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

AS7C251MFT32A-65TQI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time6.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density33554432 bit
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals100
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.1 A
Minimum standby current2.38 V
Maximum slew rate0.31 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
Base Number Matches1
iPhone backup solution
iPhone backup solution module, can be made into data cable, charger, adapter, power bank, power strip, etc....
cto Mobile and portable
Test-driven embedded C language development
"Test-Driven Embedded C Development" introduces in depth how to apply test-driven development methods to embedded C development. The first part introduces two open source test frameworks and develops ...
arui1999 Download Centre
Definitions and Differences of EMI, EMS and EMC
The difference in the definitions of EMI, EMS and EMC: EMI stands for Electromagnetic Interference, which refers to the electromagnetic waves generated by electronic equipment during its own operation...
MartinFowler Power technology
What affects the output distortion of an op amp?
As shown in the figure, the yellow is the input signal, and the blue is the output signal amplified 100 times. [color=#ff0000]Why is the peak value of the output signal fluctuating? [/color] The op am...
sfcsdc Analog electronics
Anlu SparkRoad Development Board Review (2) Simple Operation of Integrated Development Environment
The FPGA integrated development environment provided by Anlu has a grand name: Tang Dynasty, or TD for short. Its functions are similar to those of Altera's Quartus II and Xilinx's ISE.   After instal...
cruelfox Domestic Chip Exchange
[RISC-V MCU CH32V103 Evaluation] 2. Compilation Environment and Routine Import
RISC-V has several advantages over ARM, but the most important one is that it is open source, which means it is free. This is a huge difference from ARM, which charges a licensing fee. So, why not use...
ddllxxrr Domestic Chip Exchange

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号