EEWORLDEEWORLDEEWORLD

Part Number

Search

EP7309-CV-C

Description
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size928KB,46 Pages
ManufacturerCirrus Logic
Websitehttp://www.cirrus.com
Download Datasheet Parametric Compare View All

EP7309-CV-C Overview

HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

EP7309-CV-C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCirrus Logic
Parts packaging codeQFP
package instructionLFQFP,
Contacts208
Reach Compliance Codecompli
Has ADCYES
Address bus width28
bit size32
maximum clock frequency13 MHz
DAC channelYES
DMA channelYES
External data bus width32
JESD-30 codeS-PQFP-G208
JESD-609 codee0
length28 mm
Number of I/O lines70
Number of terminals208
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
ROM programmabilityFLASH
Maximum seat height1.6 mm
Maximum supply voltage2.7 V
Minimum supply voltage2.3 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width28 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
EP7309 Data Sheet
FEATURES
I
ARM720T Processor
— ARM7TDMI CPU
— 8 KB of four-way set-associative cache
— MMU with 64-entry TLB
— Thumb code support enabled
I
Ultra low power
— 90 mW at 74 MHz typical
— 30 mW at 18 MHz typical
— 10 mW in the Idle State
— <1 mW in the Standby State
I
Advanced audio decoder/decompression capability
— Supports bit streams with adaptive bit rates
— Allows for support of multiple audio
decompression algorithms (MP3, WMA, AAC,
ADPCM, Audible, etc.)
High-Performance,
Low-Power System on Chip
Enhanced
Digital Audio Interface
OVERVIEW
The Maverick™ EP7309 is designed for ultra-low-power
applications such as digital music players, internet
appliances, smart cellular phones or any hand-held
device that features the added capability of digital audio
decompression. The core-logic functionality of the device
is built around an ARM720T processor with 8 KB of four-
way set-associative unified cache and a write buffer.
Incorporated into the ARM720T is an enhanced memory
management unit (MMU) which allows for support of
sophisticated operating systems like Microsoft
®
Windows
®
CE and Linux
®
.
(cont.)
(cont.)
BLOCK DIAGRAM
Digital
Audio
Interface
Power
Management
EPB Bus
Clocks &
Timers
ICE-JTAG
SERIAL PORTS
Serial
Interface
ARM720T
ARM7TDMI CPU Core
Interrupts,
PWM & GPIO
USER INTERFACE
(2) UARTs
w/ IrDA
Internal Data Bus
Boot
ROM
8 KB
Write
Cache
Buffer
MMU
Bus
Bridge
Keypad&
Touch
Screen I/F
MaverickKey
TM
SRAM &
FLASH I/F
On-chip SRAM
48 KB
LCD
Controller
MEMORY AND STORAGE
Copyright 2001 Cirrus Logic (All Rights Reserved)
P.O. Box 17847, Austin, Texas 78760
(512) 445 7222 FAX: (512) 445 7581
http://www.cirrus.com
June ’01
DS507PP1
1

EP7309-CV-C Related Products

EP7309-CV-C EP7309-CB-C EP7309-CR-C EP7309-EB-C EP7309-ER-C EP7309-EV-C EP7309-IB-C EP7309-IR-C EP7309-IV-C
Description HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic
Parts packaging code QFP BGA BGA BGA BGA QFP BGA BGA QFP
package instruction LFQFP, BGA, TFBGA, BGA, TFBGA, LFQFP, BGA, TFBGA, LFQFP,
Contacts 208 256 204 256 204 208 256 204 208
Reach Compliance Code compli compli compli compli compli compli compli compli compli
JESD-30 code S-PQFP-G208 S-PBGA-B256 S-PBGA-B204 S-PBGA-B256 S-PBGA-B204 S-PQFP-G208 S-PBGA-B256 S-PBGA-B204 S-PQFP-G208
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 28 mm 17 mm 13 mm 17 mm 13 mm 28 mm 17 mm 13 mm 28 mm
Number of terminals 208 256 204 256 204 208 256 204 208
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C
Minimum operating temperature - - - -20 °C -20 °C -20 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP BGA TFBGA BGA TFBGA LFQFP BGA TFBGA LFQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 240 NOT SPECIFIED 240 NOT SPECIFIED 240 NOT SPECIFIED NOT SPECIFIED 240 NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.8 mm 1.2 mm 1.8 mm 1.2 mm 1.6 mm 1.8 mm 1.2 mm 1.6 mm
Maximum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form GULL WING BALL BALL BALL BALL GULL WING BALL BALL GULL WING
Terminal pitch 0.5 mm 1 mm 0.65 mm 1 mm 0.65 mm 0.5 mm 1 mm 0.65 mm 0.5 mm
Terminal location QUAD BOTTOM BOTTOM BOTTOM BOTTOM QUAD BOTTOM BOTTOM QUAD
Maximum time at peak reflow temperature 30 NOT SPECIFIED 30 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED
width 28 mm 17 mm 13 mm 17 mm 13 mm 28 mm 17 mm 13 mm 28 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Has ADC YES YES YES - - - YES YES YES
Address bus width 28 28 28 - - - 28 28 28
bit size 32 32 32 - - - 32 32 32
maximum clock frequency 13 MHz - 13 MHz - - - 13 MHz 13 MHz 13 MHz
DAC channel YES YES YES - - - YES YES YES
DMA channel YES YES YES - - - YES YES YES
External data bus width 32 32 32 - - - 32 32 32
Number of I/O lines 70 70 27 - - - 27 27 27
PWM channel YES YES YES - - - YES YES YES
ROM programmability FLASH FLASH FLASH - - - FLASH FLASH FLASH
Ask God
Please help me with this silk screen: L32W572 cannot be found....
HUG99 Analog electronics
Ask for help fast
Hello, I would like to ask about the MSP430F5529 intelligent tracking car. I have written the basic program and want to improve it further to increase its speed and stability when turning. For example...
SuperJc Motor Drive Control(Motor Control)
SHT31 Evaluation + Temperature and Humidity Accuracy
[i=s]This post was last edited by sylar^z on 2020-1-30 17:16[/i]SHT31 is a new digital sensor with a temperature detection range of 0-90°C with an accuracy of ±0.2°C and a humidity detection range of ...
sylar^z Special Edition for Assessment Centres
Netizens dismantle a 1968 US military computer
This machine has been in my eBay collection for a long time. One day, I accidentally glanced at my collection and suddenly found that the seller had greatly reduced the price to only $15, and there wa...
ohahaha Making friends through disassembly
[ST NUCLEO-H743ZI Review] + 5. CAN communication transceiver test
[i=s]This post was last edited by TL-LED on 2020-6-1 14:36[/i]Use the SPI-CAN circuit on the Ardunio expansion board to implement CAN communication. The STM32H743 itself has CAN communication, and the...
TL-LED stm32/stm8
Request resume
Shanghai Xinling Microelectronics Co., Ltd. is a startup company engaged in analog integrated circuit design and manufacturing in Shanghai.The company's business development needs to recruit 1 to 2 an...
DH895653 Recruitment

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号