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EP7309-EB-C

Description
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size928KB,46 Pages
ManufacturerCirrus Logic
Websitehttp://www.cirrus.com
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EP7309-EB-C Overview

HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

EP7309-EB-C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCirrus Logic
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Codecompli
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
Number of terminals256
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.8 mm
Maximum supply voltage2.7 V
Minimum supply voltage2.3 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width17 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
EP7309 Data Sheet
FEATURES
I
ARM720T Processor
— ARM7TDMI CPU
— 8 KB of four-way set-associative cache
— MMU with 64-entry TLB
— Thumb code support enabled
I
Ultra low power
— 90 mW at 74 MHz typical
— 30 mW at 18 MHz typical
— 10 mW in the Idle State
— <1 mW in the Standby State
I
Advanced audio decoder/decompression capability
— Supports bit streams with adaptive bit rates
— Allows for support of multiple audio
decompression algorithms (MP3, WMA, AAC,
ADPCM, Audible, etc.)
High-Performance,
Low-Power System on Chip
Enhanced
Digital Audio Interface
OVERVIEW
The Maverick™ EP7309 is designed for ultra-low-power
applications such as digital music players, internet
appliances, smart cellular phones or any hand-held
device that features the added capability of digital audio
decompression. The core-logic functionality of the device
is built around an ARM720T processor with 8 KB of four-
way set-associative unified cache and a write buffer.
Incorporated into the ARM720T is an enhanced memory
management unit (MMU) which allows for support of
sophisticated operating systems like Microsoft
®
Windows
®
CE and Linux
®
.
(cont.)
(cont.)
BLOCK DIAGRAM
Digital
Audio
Interface
Power
Management
EPB Bus
Clocks &
Timers
ICE-JTAG
SERIAL PORTS
Serial
Interface
ARM720T
ARM7TDMI CPU Core
Interrupts,
PWM & GPIO
USER INTERFACE
(2) UARTs
w/ IrDA
Internal Data Bus
Boot
ROM
8 KB
Write
Cache
Buffer
MMU
Bus
Bridge
Keypad&
Touch
Screen I/F
MaverickKey
TM
SRAM &
FLASH I/F
On-chip SRAM
48 KB
LCD
Controller
MEMORY AND STORAGE
Copyright 2001 Cirrus Logic (All Rights Reserved)
P.O. Box 17847, Austin, Texas 78760
(512) 445 7222 FAX: (512) 445 7581
http://www.cirrus.com
June ’01
DS507PP1
1

EP7309-EB-C Related Products

EP7309-EB-C EP7309-CB-C EP7309-CR-C EP7309-CV-C EP7309-ER-C EP7309-EV-C EP7309-IB-C EP7309-IR-C EP7309-IV-C
Description HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic Cirrus Logic
Parts packaging code BGA BGA BGA QFP BGA QFP BGA BGA QFP
package instruction BGA, BGA, TFBGA, LFQFP, TFBGA, LFQFP, BGA, TFBGA, LFQFP,
Contacts 256 256 204 208 204 208 256 204 208
Reach Compliance Code compli compli compli compli compli compli compli compli compli
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B204 S-PQFP-G208 S-PBGA-B204 S-PQFP-G208 S-PBGA-B256 S-PBGA-B204 S-PQFP-G208
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 17 mm 17 mm 13 mm 28 mm 13 mm 28 mm 17 mm 13 mm 28 mm
Number of terminals 256 256 204 208 204 208 256 204 208
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C
Minimum operating temperature -20 °C - - - -20 °C -20 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA TFBGA LFQFP TFBGA LFQFP BGA TFBGA LFQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED 240 240 240 NOT SPECIFIED NOT SPECIFIED 240 NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.8 mm 1.8 mm 1.2 mm 1.6 mm 1.2 mm 1.6 mm 1.8 mm 1.2 mm 1.6 mm
Maximum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form BALL BALL BALL GULL WING BALL GULL WING BALL BALL GULL WING
Terminal pitch 1 mm 1 mm 0.65 mm 0.5 mm 0.65 mm 0.5 mm 1 mm 0.65 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM QUAD BOTTOM QUAD BOTTOM BOTTOM QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 30 30 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED
width 17 mm 17 mm 13 mm 28 mm 13 mm 28 mm 17 mm 13 mm 28 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Has ADC - YES YES YES - - YES YES YES
Address bus width - 28 28 28 - - 28 28 28
bit size - 32 32 32 - - 32 32 32
DAC channel - YES YES YES - - YES YES YES
DMA channel - YES YES YES - - YES YES YES
External data bus width - 32 32 32 - - 32 32 32
Number of I/O lines - 70 27 70 - - 27 27 27
PWM channel - YES YES YES - - YES YES YES
ROM programmability - FLASH FLASH FLASH - - FLASH FLASH FLASH
maximum clock frequency - - 13 MHz 13 MHz - - 13 MHz 13 MHz 13 MHz

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