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MT48LC4M32B2F5-7

Description
Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, PLASTIC, VFBGA-90
Categorystorage    storage   
File Size2MB,67 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
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MT48LC4M32B2F5-7 Overview

Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, PLASTIC, VFBGA-90

MT48LC4M32B2F5-7 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instructionVFBGA, BGA90,9X15,32
Contacts90
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time5.5 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)143 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PBGA-B90
JESD-609 codee0
length13 mm
memory density134217728 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals90
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA90,9X15,32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)235
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.002 A
Maximum slew rate0.32 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width8 mm
Base Number Matches1

MT48LC4M32B2F5-7 Related Products

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Description Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, PLASTIC, VFBGA-90 Synchronous DRAM, 4MX32, 5.5ns, CMOS, PDSO86, 0.40 INCH, LEAD FREE, PLASTIC, TSOP-86 Synchronous DRAM, 4MX32, 5.5ns, CMOS, PDSO86, 0.40 INCH, LEAD FREE, PLASTIC, TSOP-86 Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, PLASTIC, VFBGA-90 Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, LEAD FREE, PLASTIC, VFBGA-90 Synchronous DRAM, 4MX32, 5.5ns, CMOS, PDSO86, 0.40 INCH, PLASTIC, TSOP-86 Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, LEAD FREE, PLASTIC, VFBGA-90
Is it Rohs certified? incompatible conform to conform to incompatible conform to incompatible conform to
Parts packaging code BGA TSOP TSOP BGA BGA TSOP BGA
package instruction VFBGA, BGA90,9X15,32 TSSOP, TSSOP86,.46,20 TSSOP, TSSOP86,.46,20 VFBGA, BGA90,9X15,32 VFBGA, BGA90,9X15,32 TSSOP, TSSOP86,.46,20 VFBGA, BGA90,9X15,32
Contacts 90 86 86 90 90 86 90
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 5.5 ns 5.5 ns 5.5 ns 5.5 ns 5.5 ns 5.5 ns 5.5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 143 MHz 143 MHz 166 MHz 166 MHz 143 MHz 143 MHz 166 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
interleaved burst length 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 code R-PBGA-B90 R-PDSO-G86 R-PDSO-G86 R-PBGA-B90 R-PBGA-B90 R-PDSO-G86 R-PBGA-B90
JESD-609 code e0 e3 e3 e0 e1 e0 e1
length 13 mm 22.22 mm 22.22 mm 13 mm 13 mm 22.22 mm 13 mm
memory density 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 90 86 86 90 90 86 90
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX32 4MX32 4MX32 4MX32 4MX32 4MX32 4MX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA TSSOP TSSOP VFBGA VFBGA TSSOP VFBGA
Encapsulate equivalent code BGA90,9X15,32 TSSOP86,.46,20 TSSOP86,.46,20 BGA90,9X15,32 BGA90,9X15,32 TSSOP86,.46,20 BGA90,9X15,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 235 260 260 235 260 235 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096 4096 4096 4096 4096
Maximum seat height 1 mm 1.2 mm 1.2 mm 1 mm 1 mm 1.2 mm 1 mm
self refresh YES YES YES YES YES YES YES
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
Maximum standby current 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A
Maximum slew rate 0.32 mA 0.32 mA 0.32 mA 0.32 mA 0.32 mA 0.32 mA 0.32 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL GULL WING GULL WING BALL BALL GULL WING BALL
Terminal pitch 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.8 mm
Terminal location BOTTOM DUAL DUAL BOTTOM BOTTOM DUAL BOTTOM
Maximum time at peak reflow temperature 30 30 30 30 30 30 30
width 8 mm 10.16 mm 10.16 mm 8 mm 8 mm 10.16 mm 8 mm
Is it lead-free? Contains lead Lead free Lead free Contains lead - Contains lead -
Maker - Micron Technology - Micron Technology Micron Technology Micron Technology Micron Technology
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