MT48LC4M32B2B5-6 datasheet, PDF

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MT48LC4M32B2B5-6: DescriptionSynchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, LEAD FREE, PLASTIC, VFBGA-90; Categorystorage storage; File Size2MB，67 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT48LC4M32B2B5-6 Overview

Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, LEAD FREE, PLASTIC, VFBGA-90

MT48LC4M32B2B5-6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	BGA
package instruction	VFBGA, BGA90,9X15,32
Contacts	90
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	5.5 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PBGA-B90
JESD-609 code	e1
length	13 mm
memory density	134217728 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	90
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA90,9X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.002 A
Maximum slew rate	0.32 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	8 mm

MT48LC4M32B2B5-6 Related Products

	MT48LC4M32B2B5-6	MT48LC4M32B2P-7	MT48LC4M32B2P-6	MT48LC4M32B2F5-7	MT48LC4M32B2F5-6	MT48LC4M32B2B5-7	MT48LC4M32B2TG-7
Description	Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, LEAD FREE, PLASTIC, VFBGA-90	Synchronous DRAM, 4MX32, 5.5ns, CMOS, PDSO86, 0.40 INCH, LEAD FREE, PLASTIC, TSOP-86	Synchronous DRAM, 4MX32, 5.5ns, CMOS, PDSO86, 0.40 INCH, LEAD FREE, PLASTIC, TSOP-86	Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, PLASTIC, VFBGA-90	Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, PLASTIC, VFBGA-90	Synchronous DRAM, 4MX32, 5.5ns, CMOS, PBGA90, (8 X 13) MM, LEAD FREE, PLASTIC, VFBGA-90	Synchronous DRAM, 4MX32, 5.5ns, CMOS, PDSO86, 0.40 INCH, PLASTIC, TSOP-86
Is it Rohs certified?	conform to	conform to	conform to	incompatible	incompatible	conform to	incompatible
Parts packaging code	BGA	TSOP	TSOP	BGA	BGA	BGA	TSOP
package instruction	VFBGA, BGA90,9X15,32	TSSOP, TSSOP86,.46,20	TSSOP, TSSOP86,.46,20	VFBGA, BGA90,9X15,32	VFBGA, BGA90,9X15,32	VFBGA, BGA90,9X15,32	TSSOP, TSSOP86,.46,20
Contacts	90	86	86	90	90	90	86
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	5.5 ns	5.5 ns	5.5 ns	5.5 ns	5.5 ns	5.5 ns	5.5 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz	143 MHz	166 MHz	143 MHz	166 MHz	143 MHz	143 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
interleaved burst length	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
JESD-30 code	R-PBGA-B90	R-PDSO-G86	R-PDSO-G86	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PDSO-G86
JESD-609 code	e1	e3	e3	e0	e0	e1	e0
length	13 mm	22.22 mm	22.22 mm	13 mm	13 mm	13 mm	22.22 mm
memory density	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1
Number of terminals	90	86	86	90	90	90	86
word count	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000	4000000	4000000	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4MX32	4MX32	4MX32	4MX32	4MX32	4MX32	4MX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	TSSOP	TSSOP	VFBGA	VFBGA	VFBGA	TSSOP
Encapsulate equivalent code	BGA90,9X15,32	TSSOP86,.46,20	TSSOP86,.46,20	BGA90,9X15,32	BGA90,9X15,32	BGA90,9X15,32	TSSOP86,.46,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	235	235	260	235
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096	4096	4096	4096	4096
Maximum seat height	1 mm	1.2 mm	1.2 mm	1 mm	1 mm	1 mm	1.2 mm
self refresh	YES	YES	YES	YES	YES	YES	YES
Continuous burst length	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP
Maximum standby current	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A
Maximum slew rate	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)
Terminal form	BALL	GULL WING	GULL WING	BALL	BALL	BALL	GULL WING
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.8 mm	0.8 mm	0.5 mm
Terminal location	BOTTOM	DUAL	DUAL	BOTTOM	BOTTOM	BOTTOM	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30
width	8 mm	10.16 mm	10.16 mm	8 mm	8 mm	8 mm	10.16 mm
Maker	Micron Technology	Micron Technology	-	-	Micron Technology	Micron Technology	Micron Technology
Is it lead-free?	-	Lead free	Lead free	Contains lead	Contains lead	-	Contains lead

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