IC,FLIP-FLOP,QUAD,D TYPE,CMOS,DIP,16PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | D FLIP-FLOP |
Maximum Frequency@Nom-Sup | 2000000 Hz |
MaximumI(ol) | 0.00036 A |
Number of functions | 4 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5/15 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class C |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Trigger type | POSITIVE EDGE |
Base Number Matches | 1 |
MM54C175J/883C | MM54C175J/883B | MM54C175J-MIL | |
---|---|---|---|
Description | IC,FLIP-FLOP,QUAD,D TYPE,CMOS,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,QUAD,D TYPE,CMOS,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,QUAD,D TYPE,CMOS,DIP,16PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
Maximum Frequency@Nom-Sup | 2000000 Hz | 2000000 Hz | 2000000 Hz |
MaximumI(ol) | 0.00036 A | 0.00036 A | 0.00036 A |
Number of functions | 4 | 4 | 4 |
Number of terminals | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
power supply | 5/15 V | 5/15 V | 5/15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Filter level | MIL-STD-883 Class C | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
Base Number Matches | 1 | 1 | 1 |