MC14053BCPD datasheet, PDF - EEWORLD Datasheet

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MC14053BCPD: DescriptionTRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08; CategoryAnalog mixed-signal IC The signal circuit; File Size195KB，7 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MC14053BCPD Overview

TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08

MC14053BCPD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
package instruction	648-08
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	SINGLE-ENDED MULTIPLEXER
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
length	19.175 mm
Nominal Negative Supply Voltage (Vsup)
Number of channels	2
Number of functions	3
Number of terminals	16
Nominal off-state isolation	50 dB
On-state resistance matching specifications	10 Ω
Maximum on-state resistance (Ron)	280 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5/15 V
Certification status	Not Qualified
Maximum seat height	4.44 mm
Maximum supply current (Isup)	0.6 mA
Nominal supply voltage (Vsup)	15 V
surface mount	NO
Maximum disconnect time	220 ns
Maximum connection time	220 ns
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

MC14053BCPD Related Products

	MC14053BCPD	MC14051BDR2	MC14053BDR2	MC14052BDR2	MC14051BCPD
Description	TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08	8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, SOIC-16	TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, SOIC-16	4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, SOIC-16	8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08
Maker	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )
package instruction	648-08	SOP, SOP16,.25	SOP,	SOP, SOP16,.25	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER
JESD-30 code	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDIP-T16
length	19.175 mm	9.9 mm	9.9 mm	9.9 mm	19.175 mm
Number of channels	2	8	2	4	8
Number of functions	3	1	3	1	1
Number of terminals	16	16	16	16	16
Nominal off-state isolation	50 dB	50 dB	50 dB	50 dB	50 dB
On-state resistance matching specifications	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω
Maximum on-state resistance (Ron)	280 Ω	280 Ω	280 Ω	280 Ω	280 Ω
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.44 mm	1.75 mm	1.75 mm	1.75 mm	4.44 mm
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V
surface mount	NO	YES	YES	YES	NO
Maximum disconnect time	220 ns	280 ns	220 ns	250 ns	280 ns
Maximum connection time	220 ns	280 ns	220 ns	250 ns	280 ns
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	3.9 mm	3.9 mm	3.9 mm	7.62 mm
JESD-609 code	e0	e0	-	e0	e0
Encapsulate equivalent code	DIP16,.3	SOP16,.25	-	SOP16,.25	DIP16,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
power supply	5/15 V	5/15 V	-	5/15 V	5/15 V
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	-	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
Parts packaging code	-	SOIC	SOIC	SOIC	DIP
Contacts	-	16	16	16	16

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