8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| length | 19.175 mm |
| Nominal Negative Supply Voltage (Vsup) | |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Nominal off-state isolation | 50 dB |
| On-state resistance matching specifications | 10 Ω |
| Maximum on-state resistance (Ron) | 280 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.44 mm |
| Maximum supply current (Isup) | 0.6 mA |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum disconnect time | 280 ns |
| Maximum connection time | 280 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MC14051BCPD | MC14053BCPD | MC14051BDR2 | MC14053BDR2 | MC14052BDR2 | |
|---|---|---|---|---|---|
| Description | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08 | TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08 | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, SOIC-16 | TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, SOIC-16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, SOIC-16 |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| package instruction | DIP, DIP16,.3 | 648-08 | SOP, SOP16,.25 | SOP, | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| length | 19.175 mm | 19.175 mm | 9.9 mm | 9.9 mm | 9.9 mm |
| Number of channels | 8 | 2 | 8 | 2 | 4 |
| Number of functions | 1 | 3 | 1 | 3 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Nominal off-state isolation | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
| On-state resistance matching specifications | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
| Maximum on-state resistance (Ron) | 280 Ω | 280 Ω | 280 Ω | 280 Ω | 280 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.44 mm | 4.44 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | YES | YES | YES |
| Maximum disconnect time | 280 ns | 220 ns | 280 ns | 220 ns | 250 ns |
| Maximum connection time | 280 ns | 220 ns | 280 ns | 220 ns | 250 ns |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Parts packaging code | DIP | - | SOIC | SOIC | SOIC |
| Contacts | 16 | - | 16 | 16 | 16 |
| JESD-609 code | e0 | e0 | e0 | - | e0 |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | SOP16,.25 | - | SOP16,.25 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| power supply | 5/15 V | 5/15 V | 5/15 V | - | 5/15 V |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
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