Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CQCC44
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | S-XQCC-J44 |
| JESD-609 code | e0 |
| Number of terminals | 44 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 512 |
| rom(word) | 16384 |
| ROM programmability | UVPROM |
| speed | 20 MHz |
| Maximum slew rate | 35 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| P87C524GFL | P87C524GFF | P87C524EBP | P87C524GFA | P87C524GFP | |
|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PDIP40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | S-XQCC-J44 | R-XDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 44 | 40 | 40 | 44 | 40 |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C | -40 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | DIP | QCCJ | DIP |
| Encapsulate equivalent code | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 512 | 512 | 512 | 512 | 512 |
| rom(word) | 16384 | 16384 | 16384 | 16384 | 16384 |
| ROM programmability | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| speed | 20 MHz | 20 MHz | 16 MHz | 20 MHz | 20 MHz |
| Maximum slew rate | 35 mA | 35 mA | 25 mA | 35 mA | 35 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL | QUAD | DUAL |
| Maker | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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