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P87C524EBP

Description
Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,18 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

P87C524EBP Overview

Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40,

P87C524EBP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP40,.6
Reach Compliance Codeunknown
bit size8
CPU series8051
JESD-30 codeR-PDIP-T40
JESD-609 codee0
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
RAM (bytes)512
rom(word)16384
ROM programmabilityUVPROM
speed16 MHz
Maximum slew rate25 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

P87C524EBP Related Products

P87C524EBP P87C524GFF P87C524GFL P87C524GFA P87C524GFP
Description Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40, Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CDIP40 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CQCC44 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PQCC44 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PDIP40
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP40,.6 DIP, DIP40,.6 QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ DIP, DIP40,.6
Reach Compliance Code unknown unknown unknown unknown unknown
bit size 8 8 8 8 8
CPU series 8051 8051 8051 8051 8051
JESD-30 code R-PDIP-T40 R-XDIP-T40 S-XQCC-J44 S-PQCC-J44 R-PDIP-T40
JESD-609 code e0 e0 e0 e0 e0
Number of terminals 40 40 44 44 40
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP QCCJ QCCJ DIP
Encapsulate equivalent code DIP40,.6 DIP40,.6 LDCC44,.7SQ LDCC44,.7SQ DIP40,.6
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 512 512 512 512 512
rom(word) 16384 16384 16384 16384 16384
ROM programmability UVPROM UVPROM UVPROM UVPROM UVPROM
speed 16 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Maximum slew rate 25 mA 35 mA 35 mA 35 mA 35 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD QUAD DUAL
Maker Philips Semiconductors (NXP Semiconductors N.V.) - - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
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