Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP40,.6 |
Reach Compliance Code | unknown |
bit size | 8 |
CPU series | 8051 |
JESD-30 code | R-PDIP-T40 |
JESD-609 code | e0 |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 512 |
rom(word) | 16384 |
ROM programmability | UVPROM |
speed | 16 MHz |
Maximum slew rate | 25 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
P87C524EBP | P87C524GFF | P87C524GFL | P87C524GFA | P87C524GFP | |
---|---|---|---|---|---|
Description | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PDIP40 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
bit size | 8 | 8 | 8 | 8 | 8 |
CPU series | 8051 | 8051 | 8051 | 8051 | 8051 |
JESD-30 code | R-PDIP-T40 | R-XDIP-T40 | S-XQCC-J44 | S-PQCC-J44 | R-PDIP-T40 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 40 | 40 | 44 | 44 | 40 |
Maximum operating temperature | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | QCCJ | QCCJ | DIP |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
Package form | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 512 | 512 | 512 | 512 | 512 |
rom(word) | 16384 | 16384 | 16384 | 16384 | 16384 |
ROM programmability | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
speed | 16 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
Maximum slew rate | 25 mA | 35 mA | 35 mA | 35 mA | 35 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |