P87C524GFF datasheet, PDF - EEWORLD Datasheet

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P87C524GFF: DescriptionMicrocontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，18 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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P87C524GFF Overview

Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CDIP40

P87C524GFF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	16384
ROM programmability	UVPROM
speed	20 MHz
Maximum slew rate	35 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

P87C524GFF Related Products

	P87C524GFF	P87C524GFL	P87C524EBP	P87C524GFA	P87C524GFP
Description	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CDIP40	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CQCC44	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40,	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PQCC44	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PDIP40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8
CPU series	8051	8051	8051	8051	8051
JESD-30 code	R-XDIP-T40	S-XQCC-J44	R-PDIP-T40	S-PQCC-J44	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0	e0
Number of terminals	40	44	40	44	40
Maximum operating temperature	85 °C	85 °C	70 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	DIP	QCCJ	DIP
Encapsulate equivalent code	DIP40,.6	LDCC44,.7SQ	DIP40,.6	LDCC44,.7SQ	DIP40,.6
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	512	512	512	512	512
rom(word)	16384	16384	16384	16384	16384
ROM programmability	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
speed	20 MHz	20 MHz	16 MHz	20 MHz	20 MHz
Maximum slew rate	35 mA	35 mA	25 mA	35 mA	35 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	QUAD	DUAL
Maker	-	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)

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