GS8662T06BGD-350T datasheet, PDF

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GS8662T06BGD-350T: DescriptionDDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, FBGA-165; Categorystorage storage; File Size427KB，31 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

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GS8662T06BGD-350T Overview

DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, FBGA-165

GS8662T06BGD-350T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	LBGA,
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	67108864 bit
Memory IC Type	DDR SRAM
memory width	8
Number of functions	1
Number of terminals	165
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX8
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm
Base Number Matches	1

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GS8662T20/38BD-550/500/450/400/350

GS8662T06/11BD-500/450/400/350

165-Bump BGA

Commercial Temp

Industrial Temp

Features

• 2.5 Clock Latency

• Simultaneous Read and Write SigmaDDR

Interface

• JEDEC-standard pinout and package

• Double Data Rate interface

• Byte Write controls sampled at data-in time

• Burst of 2 Read and Write

• On-Die Termination (ODT) on Data (D), Byte Write (BW),

and Clock (K, K) inputs

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ pin for programmable output drive strength

• Data Valid Pin (QVLD) Support

• IEEE 1149.1 JTAG-compliant Boundary Scan

• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

72Mb SigmaDDR

-II+

Burst of 2 SRAM

550 MHz–350 MHz

1.8 V V

1.8 V or 1.5 V I/O

SRAMs are just one element in a family of low power, low

voltage HSTL I/O SRAMs designed to operate at the speeds

needed to implement economical high performance

networking systems.

Clocking and Addressing Schemes

The GS8662T06/11/20/38BD SigmaDDR-II+ SRAMs are

synchronous devices. They employ two input register clock

inputs, K and K. K and K are independent single-ended clock

inputs, not differential inputs to a single differential clock input

buffer.

Each internal read and write operation in a SigmaDDR-II+ B2

RAM is two times wider than the device I/O bus. An input data

bus de-multiplexer is used to accumulate incoming data before

it is simultaneously written to the memory array. An output

data multiplexer is used to capture the data produced from a

single memory array read and then route it to the appropriate

output drivers as needed. Therefore, the address field of a

SigmaDDR-II+ B2 RAM is always one address pin less than

the advertised index depth (e.g., the 8M x 8 has an 4M

addressable index).

SigmaDDR-II™ Family Overview

The GS8662T06/11/20/38BD are built in compliance with the

SigmaDDR-II+ SRAM pinout standard for Common I/O

synchronous SRAMs. They are 75,497,472-bit (72Mb)

SRAMs. The GS8662T06/11/20/38BD SigmaDDR-II+

Parameter Synopsis (x18/x36)

-550

tKHKH

tKHQV

1.81 ns

0.29ns

-500

2.0 ns

0.33 ns

-450

2.2 ns

0.37 ns

-400

2.5 ns

0.45 ns

-350

2.86 ns

0.45 ns

Parameter Synopsis (x8/x9)

-500

tKHKH

tKHQV

2.0 ns

0.33 ns

-450

2.2 ns

0.37ns

-400

2.5 ns

0.45 ns

-350

2.86 ns

0.45 ns

Rev: 1.02b 11/2011

1/31

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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