EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

LH540203K-65

Description
FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28
Categorystorage    storage   
File Size886KB,16 Pages
ManufacturerSHARP
Websitehttp://sharp-world.com/products/device/
Download Datasheet Parametric Compare View All

LH540203K-65 Overview

FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28

LH540203K-65 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction0.300 INCH, PLASTIC, SOJ-28
Reach Compliance Codeunknown
Maximum access time65 ns
Other featuresRETRANSMIT
period time80 ns
JESD-30 codeR-PDSO-J28
JESD-609 codee0
length18.5 mm
memory density18432 bit
memory width9
Number of functions1
Number of terminals28
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX9
Output characteristics3-STATE
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height3.7 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.7 mm
Base Number Matches1

LH540203K-65 Related Products

LH540203K-65 LH540203U-65 LH540203D-80 LH540203K-80 LH540203U-80 LH540203D-65 LH540203-65 LH540203-80
Description FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 FIFO, 2KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 FIFO, 2KX9, 80ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 FIFO, 2KX9, 80ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 FIFO, 2KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction 0.300 INCH, PLASTIC, SOJ-28 0.450 INCH, PLASTIC, LCC-32 0.300 INCH, PLASTIC, DIP-28 0.300 INCH, PLASTIC, SOJ-28 0.450 INCH, PLASTIC, LCC-32 0.300 INCH, PLASTIC, DIP-28 0.600 INCH, PLASTIC, DIP-28 0.600 INCH, PLASTIC, DIP-28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 65 ns 65 ns 80 ns 80 ns 80 ns 65 ns 65 ns 80 ns
Other features RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
period time 80 ns 80 ns 100 ns 100 ns 100 ns 80 ns 80 ns 100 ns
JESD-30 code R-PDSO-J28 R-PQCC-J32 R-PDIP-T28 R-PDSO-J28 R-PQCC-J32 R-PDIP-T28 R-PDIP-T28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 18.5 mm 13.995 mm 34.67 mm 18.5 mm 13.995 mm 34.67 mm 36 mm 36 mm
memory density 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit
memory width 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 28 32 28 28 32 28 28 28
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable NO NO NO NO NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOJ QCCJ DIP SOJ QCCJ DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE CHIP CARRIER IN-LINE SMALL OUTLINE CHIP CARRIER IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.7 mm 3.56 mm 4.57 mm 3.7 mm 3.56 mm 4.57 mm 5.2 mm 5.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES YES NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND J BEND THROUGH-HOLE J BEND J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL QUAD DUAL DUAL QUAD DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.7 mm 11.455 mm 7.62 mm 7.7 mm 11.455 mm 7.62 mm 15.24 mm 15.24 mm
Maker - - SHARP SHARP SHARP SHARP SHARP SHARP
Implementation of time isolation based on SAFERTOS system
SAFECheckpoints In the functional safety system based on SAFERTOS, in addition to spatial isolation, time isolation function may be required for different safety standards to ensure the time processin...
MamoYU Embedded System
ADI designs RF transceivers for GSM and GPRS wireless handsets
Analog Devices, Inc. has introduced a chip that can reduce the RF circuit of a cellular phone to 1.5 square centimeters. This new Othello-G RF chip suitable for GSM/GPRS communication standards can pr...
JasonYoo RF/Wirelessly
Summary of issues that should be paid attention to when designing analog circuits
The design of analog circuits is the most troublesome but also the most fatal design part for engineers! We have summarized the issues that should be paid attention to in analog circuit design and sha...
Jacktang Analogue and Mixed Signal
I make a bubble on time
Just to make some bubbles and prepare to boil water{:1_138:}:congratulate:{:1_144:}...
btty038 RF/Wirelessly
Electronic circuit and EMI/EMC design analysis
Electronic circuit and EMI/EMC design analysis[ Print ][ Return ]For a good electronic product, in addition to the functions of the product itself, the technical level of circuit design and electromag...
fighting Analog electronics
Help! CCS7.3 enters the exit.c file after entering debug mode. I don't know how to solve it
[i=s] This post was last edited by lcl on the road on 2019-6-12 14:25[/i]I am using dsp2808. There is no error in the program after compiling, but it exits immediately after entering debug mode.c file...
lcl在路上 Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号