LH540203U-65 datasheet, PDF - EEWORLD Datasheet

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LH540203U-65: DescriptionFIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32; Categorystorage storage; File Size886KB，16 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH540203U-65 Overview

FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32

LH540203U-65 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	0.450 INCH, PLASTIC, LCC-32
Reach Compliance Code	unknown
Maximum access time	65 ns
Other features	RETRANSMIT
period time	80 ns
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.995 mm
memory density	18432 bit
memory width	9
Number of functions	1
Number of terminals	32
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.455 mm
Base Number Matches	1

LH540203U-65 Related Products

	LH540203U-65	LH540203K-65	LH540203D-80	LH540203K-80	LH540203U-80	LH540203D-65	LH540203-65	LH540203-80
Description	FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32	FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	FIFO, 2KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 80ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	FIFO, 2KX9, 80ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32	FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	0.450 INCH, PLASTIC, LCC-32	0.300 INCH, PLASTIC, SOJ-28	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, SOJ-28	0.450 INCH, PLASTIC, LCC-32	0.300 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	65 ns	65 ns	80 ns	80 ns	80 ns	65 ns	65 ns	80 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
period time	80 ns	80 ns	100 ns	100 ns	100 ns	80 ns	80 ns	100 ns
JESD-30 code	R-PQCC-J32	R-PDSO-J28	R-PDIP-T28	R-PDSO-J28	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	13.995 mm	18.5 mm	34.67 mm	18.5 mm	13.995 mm	34.67 mm	36 mm	36 mm
memory density	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit
memory width	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	28	28	28	32	28	28	28
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	SOJ	DIP	SOJ	QCCJ	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.56 mm	3.7 mm	4.57 mm	3.7 mm	3.56 mm	4.57 mm	5.2 mm	5.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.455 mm	7.7 mm	7.62 mm	7.7 mm	11.455 mm	7.62 mm	15.24 mm	15.24 mm
Maker	-	-	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP

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