IC,BUFFER/DRIVER,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
Control type | ENABLE LOW |
JESD-30 code | R-PDIP-T20 |
JESD-609 code | e0 |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.006 A |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
MM74HC541N/A+ | MM54HC541J/883C | MM54HC541J/883B | |
---|---|---|---|
Description | IC,BUFFER/DRIVER,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | compliant | compliant |
Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-PDIP-T20 | R-XDIP-T20 | R-XDIP-T20 |
JESD-609 code | e0 | e0 | e0 |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.006 A | 0.006 A | 0.006 A |
Number of digits | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 |
Maximum operating temperature | 85 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -55 °C | -55 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Output polarity | TRUE | TRUE | TRUE |
Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
power supply | 2/6 V | 2/6 V | 2/6 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 |
Maker | - | National Semiconductor(TI ) | National Semiconductor(TI ) |
Certification status | - | Not Qualified | Not Qualified |
Filter level | - | MIL-STD-883 Class C | 38535Q/M;38534H;883B |